Jaya, B. N.; Kirchlechner, C.; Dehm, G.: Can micro-scale fracture tests provide reliable fracture toughness values? A case study in silicon. Journal of Materials Research 30 (5), pp. 686 - 698 (2015)

Kim, K.-H.; Jeon, J. B.; Lee, B.-J.: Modified embedded-atom method interatomic potentials for Mg–X (X=Y, Sn, Ca) binary systems. CALPHAD: Computer Coupling of Phase Diagrams and Thermochemistry 48, pp. 27 - 34 (2015)

Schaffnit, P.; Stallybrass, C.; Konrad, J.; Stein, F.; Weinberg, M.: A Scheil-Gulliver model dedicated to the solidification of steel. CALPHAD: Computer Coupling of Phase Diagrams and Thermochemistry 48, pp. 184 - 188 (2015)

Hoffmann, R.; Kirchlechner, C.; Langer, G.; Wochnik, A. S.; Griesshaber, E.; Schmahl, W. W.; Scheu, C.: Insight into Emiliania huxleyi coccospheres by focused ion beam sectioning. Biogeosciences 12 (12), pp. 825 - 834 (2015)

Harzer, T. P.; Djaziri, S.; Raghavan, R.; Dehm, G.: Nanostructure and mechanical behavior of metastable Cu–Cr thin films grown by molecular beam epitaxy. Acta Materialia 83, pp. 318 - 332 (2015)

Cordill, M. J.; Glushko, O.; Kreith, J.; Marx, V. M.; Kirchlechner, C.: Measuring electro-mechanical properties of thin films on polymer substrates. Microelectronic Engineering 137 (1), pp. 96 - 100 (2015)

Faurie, D.; Djaziri, S.; Renault, P. O.; Le Bourhis, É.; Goudeau, P. H.; Geandier, G.; Thiaudière, D.: Biaxial machine at Diffabs beamline for studying mechanical properties of thin films deposited onto polymer substrates [Machine biaxiale sur la ligne de lumiere Diffabs pour l'etude des proprietes mecaniques de films minces deposes sur substrats polymeres]. Materiaux et Techniques 103 (6), 610 (2015)

Heinz, W.; Robl, W.; Dehm, G.: Influence of initial microstructure on thermomechanical fatigue behavior of Cu films on substrates. Microelectronic Engineering 137, pp. 5 - 10 (2015)

Kirchlechner, C.; Imrich, P. J.; Liegl, W.; Pörnbacher, J.; Micha, J.-S.; Ullrich, O.; Motz, C.: On the reversibility of dislocation slip during small scale low cycle fatigue. Acta Materialia 94, pp. 69 - 77 (2015)

Reiche, H. M.; Carpenter, J.; Stein, F.; Tomida, T.; Vogel, S. C.: Metallurgical studies with the HIPPO diffractometer at LANSCE. Canadian Metallurgy Quaterly 54 (1), pp. 2 - 8 (2015)

Völker, B.; Heinz, W.; Matoy, K.; Roth, R.; Batke, J. M.; Schöberl, T.; Scheu, C.; Dehm, G.: Interface fracture and chemistry of a tungsten-based metallization on borophosphosilicate glass. Philosophical Magazine 95 (16-18), pp. 1967 - 1981 (2015)

Völker, B.; Venkatesan, S.; Heinz, W.; Matoy, K.; Roth, R.; Batke, J. M.; Cordill, M. J.; Dehm, G.: Following crack path selection in multi-film structures with weak and strong interfaces by in-situ 4-point-bending. Journal of Materials Research 30 (8), pp. 1090 - 1097 (2015)

Wimmer, A. C.; Heinz, W.; Detzel, T.; Robl, W.; Nellessen, M.; Kirchlechner, C.; Dehm, G.: Cyclic bending experiments on freestanding Cu micron lines observed by EBSD. Acta Materialia 83, pp. 460 - 469 (2015)

Zhang, Z.; Dehm, G.: Study on the Atomic and Electronic Structure in CrN (VN, TiN) Films using C_s-Corrected TEM. Microscopy and Microanalysis 21 (3), pp. 2079 - 2080 (2015)

Soler, R.; Wheeler, J. M.; Chang, H.; Segurado, J.; Michler, J.; Llorca, J.; Molina-Aldareguía, J. M.: Understanding size effects on the strength of single crystals through high-temperature micropillar compression. Acta Materialia 81, pp. 50 - 57 (2014)

Cordill, M. J.; Marx, V. M.; Kirchlechner, C.: Ductile film delamination from compliant substrates using hard overlayers. Thin Solid Films 571 (P2), pp. 302 - 307 (2014)

Brinckmann, S.; Völker, B.; Dehm, G.: Crack deflection in multi-layered four-point bending samples. International Journal of Fracture 190 (1-2), pp. 167 - 176 (2014)

Farokhipoor, S.; Magén, C.; Venkatesan, S.; Íñiguez, J.; Daumont, C. J. M.; Rubí, D.; Snoeck, É.; Mostovoy, M. V.; De Graaf, C.; Müller, A. et al.; Döblinger, M.; Scheu, C.; Noheda, B.: Artificial chemical and magnetic structure at the domain walls of an epitaxial oxide. Nature 515 (7527), pp. 379 - 383 (2014)

Wimmer, A. C.; Smółka, M. N.; Heinz, W.; Detzel, T.; Robl, W.; Motz, C.; Eyert, V.; Wimmer, E.; Jahnel, F.; Treichler, R. et al.; Dehm, G.: Temperature dependent transition of intragranular plastic to intergranular brittle failure in electrodeposited Cu micro-tensile samples. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 618, pp. 398 - 405 (2014)

Abboud, A.; Kirchlechner, C.; Send, S.; Micha, J.-S.; Ulrich, O.; Pashniak, N.; Strüder, L. W.; Kečkéš, J.; Pietsch, U.: A new method for polychromatic X-ray μLaue diffraction on a Cu pillar using an energy-dispersive pn-junction charge-coupled device. Review of Scientific Instruments 85 (11), 113901 (2014)