Journal Article
Li, J.; He, S.; Röder, F.; Winkler, J.; Zhao, P.; Jang, K.; Zhang, S.; Pandey, A.; Wrzesińska-Lashkova, A.; Vaynzof, Y. et al.; Scheu, C.; Nielsch, K.; Bahrami, A.: Atomic Layer Deposited Cu Incorporation Enables Enhanced Thermoelectric Performance in n-Type Mg
3(Sb, Bi)
2. Small structures
7 (3), e202500906 (2026)