Publications of Rajchawit Sarochawikasit

Ratanaphan, S.; Raabe, D.; Sarochawikasit, R.; Olmsted, D. L.; Rohrer, G. S.; Tu, K.: Grain boundary character distribution in electroplated nanotwinned copper. Journal of Materials Science 52 (7), pp. 4070 - 4085 (2017)