Home Research Research Departments Circular Metallurgy and Alloy Design Materials at the Atomic Scale Thermoelectric Materials Design by controlling the microstructure and composition Publications of Klaus Heckmann All genres Journal Article (1) Journal Article (1) 1. Journal Article Müller, R.; Heckmann, K.; Habermann, M.; Paul, T.; Stratmann, M.: New adhesion promoters for copper leadframes and epoxy resin. Journal of Adhesion 72 (1), pp. 65 - 83 (2000) MPG.PuRe DOI