Home Research Research Departments Microstructure Physics and Alloy Design Materials at the Atomic Scale CIGS grain boundaries Publications of Klaus Heckmann All genres Journal Article (1) Journal Article (1) 1. Journal Article Müller, R.; Heckmann, K.; Habermann, M.; Paul, T.; Stratmann, M.: New adhesion promoters for copper leadframes and epoxy resin. Journal of Adhesion 72 (1), pp. 65 - 83 (2000) MPG.PuRe DOI