Home Research Research Departments Microstructure Physics and Alloy Design Plastic Deformation of Materials Mechanical and chemical characterization of grain boundaries Publications of Klaus Heckmann All genres Journal Article (1) Journal Article (1) 1. Journal Article Müller, R.; Heckmann, K.; Habermann, M.; Paul, T.; Stratmann, M.: New adhesion promoters for copper leadframes and epoxy resin. Journal of Adhesion 72 (1), pp. 65 - 83 (2000) MPG.PuRe DOI