Publications

Publications of Gerhard Dehm

Talk (288)

641.
Talk
Dehm, G.: In situ nano- and micromechanics of materials. International Workshop on Advanced and In-situ Microscopies of Functional Nanomaterials and Devices – IAMNano 2015, Hamburg, Germany (2015)
642.
Talk
Duarte, M. J.; Brinckmann, S.; Renner, F. U.; Dehm, G.: Nanomechanical testing under environmental conditins of Fe-based metallic glasses. 22st International Symposium on Metastable Amorphous and Nanostructured Materials, ISMANAM 2015, Paris, France (2015)
643.
Talk
Raghavan, R.; Wheeler, J. M.; Esqué-de los Ojos, D.; Thomas, K.; Almandoz, E.; Fuentes, G.; Harzer, T. P.; Chawla, V.; Djaziri, S.; Philippi, B. et al.; Wehrs, J.; Michler, J.; Dehm, G.: Thermo-mechanical behavior of nanolayered thin films. 9th European Solid Mechanics Conference (ESMC 2015), Leganés-Madrid, Spain (2015)
644.
Talk
Soler, R.; Venkatesan, S.; Heinz, W.; Roth, R.; Nelhiebel, M.; Fugger, J.; Kirchlechner, C.; Dehm, G.: Analysis of the interface fracture resistance of multi-layered thin film structures under various service conditions. ESMC2015, Madrid, Spain (2015)
645.
Talk
Hieke, S. W.; Dehm, G.; Scheu, C.: Temperature induced faceted hole formation in epitaxial Al thin films on sapphire. Understanding Grain Boundary Migration: Theory Meets Experiment, Günzburg/Donau, Germany (2015)
646.
Talk
Dehm, G.: Thermo-mechanical fatigue in thin fcc films. PICS meeting, Marseilles, France (2015)
647.
Talk
Malyar, N.; Kirchlechner, C.; Dehm, G.: Dislocation grain boundary interaction in bi-crystalline micro pillars studied by in situ SEM and in situ µLaue diffraction. ICM 12 - 12th International Conference on the Mechanical Behavior of Materials, Karlsruhe, Germany (2015)
648.
Talk
Dehm, G.: In situ nanocompression testing in the TEM: Challenges and benefits. Symposium Advanced Electron Microscopy for Materials Research, Erlangen, Germany (2015)
649.
Talk
Jaya, B. N.; Köhler, M.; Schnabel, V.; Raabe, D.; Schneider, J. M.; Jayaram, V.; Kirchlechner, C.; Dehm, G.: Fracture property characterization in brittle films and coatings. 42nd ICMCTF, San Diego, CA, USA (2015)
650.
Talk
Kirchlechner, C.; Malyar, N.; Imrich, P. J.; Dehm, G.: Plastische Verformung an Korngrenzen: Neue Einblicke durch miniaturisierte Zug- und Druckversuche. 11. Tagung Gefüge und Bruch (2015), Leoben, Austria (2015)
651.
Talk
Dehm, G.: Small Scale Mechanical Testing: More than just a fashionably tool?! POSTECH, Pohang, South-Korea (2015)
652.
Talk
Fink, C.; Brinckmann, S.; Shin, S.; Dehm, G.: Nanotribology and Microstructure Evolution in Pearlite. Frühjahrstagung der Sektion Kondensierte Materie der Deutschen Physikalischen Gesellschaft , Berlin, Germany (2015)
653.
Talk
Malyar, N.; Dehm, G.; Kirchlechner, C.: Insights into dislocation slip transfer by µLaue diffraction. Arbeitskreis-Treffen der Deutschen Gesellschaft für Materialkunde (DGM) e.V. „Rasterkraftmikroskopie und nanomechanische Methoden“, Darmstadt, Germany (2015)
654.
Talk
Marx, V. M.; Kirchlechner, C.; Cordill, M. J.; Dehm, G.: The mechanical behavior of thin cobalt films on polyimide. Arbeitskreistreffen Rasterkraftmikroskopie und nanomechanische Methoden, TU Darmstadt, Darmstadt, Germny (2015)
655.
Talk
Wimmer, A. C.; Heinz, W.; Leitner, A.; Detzel, T.; Robl, W.; Kirchlechner, C.; Dehm, G.: Small scale mechanical testing of Cu structures at variable temperatures. TMS 2015, Orlando, USA (2015)
656.
Talk
Dehm, G.: Structure and Nano-/Micromechanics of Materials. Chemisch-Physikalisch-Technische Sektion der Max-Planck-Gesellschaft, Berlin, Germany (2015)
657.
Talk
Dehm, G.: New Insights into Materials Phenomena by Advanced TEM. Symposium: Advanced Materials Analysis by latest STEM Technologies, Mülheim an der Ruhr, Germany (2015)
658.
Talk
Brinckmann, S.; Fink, C.; Dehm, G.: Roughness and Microstructure Development during Nanotribology in Austenite. DPG-Spring Meeting, Berlin, Germany (2015)
659.
Talk
Dehm, G.: Tutorial on Thin Films: Stresses, Relaxation, and Size Effects. Electronic Materials and Applications, Orlando, FL, USA (2015)
660.
Talk
Dehm, G.: Probing deformation mechanisms of Cu structures relevant for electronic applications. Electronic Materials and Applications, Orlando, FL, USA (2015)
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