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Journal Article (7)

1.
Journal Article
Wimmer, A. C.; Heinz, W.; Leitner, A.; Detzel, T.; Robl, W.; Kirchlechner, C.; Dehm, G.: Micro-tension study of miniaturized Cu lines at variable temperatures. Acta Materialia 92, pp. 243 - 254 (2015)
2.
Journal Article
Heinz, W.; Robl, W.; Dehm, G.: Influence of initial microstructure on thermomechanical fatigue behavior of Cu films on substrates. Microelectronic Engineering 137, pp. 5 - 10 (2015)
3.
Journal Article
Wimmer, A. C.; Heinz, W.; Detzel, T.; Robl, W.; Nellessen, M.; Kirchlechner, C.; Dehm, G.: Cyclic bending experiments on freestanding Cu micron lines observed by EBSD. Acta Materialia 83, pp. 460 - 469 (2015)
4.
Journal Article
Wimmer, A. C.; Smółka, M. N.; Heinz, W.; Detzel, T.; Robl, W.; Motz, C.; Eyert, V.; Wimmer, E.; Jahnel, F.; Treichler, R. et al.; Dehm, G.: Temperature dependent transition of intragranular plastic to intergranular brittle failure in electrodeposited Cu micro-tensile samples. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 618, pp. 398 - 405 (2014)
5.
Journal Article
Wimmer, A.; Leitner, A.; Detzel, T.; Robl, W.; Heinz, W.; Pippan, R.; Dehm, G.: Damage evolution during cyclic tension-tension loading of micron-sized Cu lines. Acta Materialia 67, pp. 297 - 307 (2014)
6.
Journal Article
Smolka, M.; Motz, C.; Detzel, T.; Robl, W.; Grießer, T.; Wimmer, A.; Dehm, G.: Novel temperature dependent tensile test of freestanding copper thin film structures. Review of Scientific Instruments 83 (6), 064702 (2012)
7.
Journal Article
Huang, R.; Robl, W.; Ceric, H.; Detzel, T.; Dehm, G.: Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing. IEEE Transactions 10 (1), pp. 47 - 54 (2010)

Conference Paper (1)

8.
Conference Paper
Huang, R.; Robl, W.; Dehm, G.; Ceric, H.; Detzel, T.: Disparate tendency of stress evolution of thin and thick electroplated Cu films at room temperature. In: Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, 5532222, pp. 1 - 6. International Symposium on the Physical and Failure Analysis of Integrated Circuits IPFA 2010, Singapore, Singapore, July 05, 2010 - July 09, 2010. IEEE (2010)

Talk (2)

9.
Talk
Du, C.; Matoy, K.; Zechner, J.; Reisinger, M.; Robl, W.; Hartl, R.; Kirchlechner, C.; Dehm, G.: Ni–P: Microstructure and micro-compression. Nanomechanical Testing in Materials Research and Development VII , Malaga, Spain (2019)
10.
Talk
Wimmer, A. C.; Heinz, W.; Leitner, A.; Detzel, T.; Robl, W.; Kirchlechner, C.; Dehm, G.: Small scale mechanical testing of Cu structures at variable temperatures. TMS 2015, Orlando, USA (2015)
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