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Zaefferer, S.: High resolution crystal orientation measurement techniques for the study of nucleation processes during recrystallization in heavily deformed metals. Le Revue de Métallurgie, pp. 891 - 901 (2003)

Zaefferer, S.; Kuo, J. C.; Zhao, Z.; Winning, M.; Raabe, D.: On the influence of the grain boundary misorientation on the plastic deformation of aluminum bicrystals. Acta Materialia 51, pp. 4719 - 4735 (2003)

Zhang, J.; Schneider, A.; Inden, G.: Characterisation of the coke formed during metal dusting of iron CO-H₂-H₂O gas mixtures. Corrosion Science 45, pp. 1329 - 1341 (2003)

Zhang, J.; Schneider, A.; Inden, G.: Coke formation during metal dusting of iron in CO–H₂–H₂O gas with high CO content. Materials Science and Corrosion 54, pp. 770 - 777 (2003)

Zhang, J.; Schneider, A.; Inden, G.: α-Fe layer formation during metal dusting of iron in CO-H₂-H₂O gas mixtures. Materials and Corrosion 54, pp. 763 - 769 (2003)

Dehm, G.; Bamberger, M. S.: Laser cladding of Co-based hardfacing on Cu substrate. Journal of Materials Science 37 (24), pp. 5345 - 5353 (2002)

Dehm, G.; Inkson, B. J.; Wagner, T. A.: Growth and microstructural stability of epitaxial Al films on (0001) α-Al₂O₃ substrates. Acta Materialia 50 (20), pp. 5021 - 5032 (2002)

Inkson, B. J.; Dehm, G.; Wagner, T. A.: In-situ TEM observation of dislocation motion in thermally strained Al nanowires. Acta Materialia 50 (20), pp. 5033 - 5047 (2002)

Rebhan, M. E.; Rohwerder, M.; Stratmann, M.: Formation of mesoscopic structures by the CVD of SiH₄ on Fe(100). Chemical Vapor Deposition 8 (6), pp. 259 - 261 (2002)

Frommeyer, G.; Liu, Z. G.; Wesemann, J.; Wanderka, N.: Investigations on field-ion image formation and field evaporation sequences of DO₃-ordered Fe₃Al. Ultramicroscopy 92 (2), pp. 57 - 66 (2002)

Varnik, F.; Baschnagel, J.; Binder, K.: Glass Transition in Thin Polymer Films: A Molecular Dynamics Study. International Journal of Modern Physics C 13 (6), pp. 799 - 804 (2002)

Beschliesser, M.; Chatterjee, A.; Lorich, A.; Knabl, W.; Kestler, H.; Dehm, G.; Clemens, H.: Designed fully lamellar microstructures in a γ-TiAl based alloy: adjustment and microstructural changes upon long-term isothermal exposure at 700 and 800 degrees C. Materials Science and Engineering A-Structural Materials Properties Microstructure and Processing 329-331, pp. 124 - 129 (2002)

Marketz, W. T.; Fischer, F. D.; Kauffmann, F.; Dehm, G.; Bidlingmaier, T.; Wanner, A.; Clemens, H.: On the role of twinning during room temperature deformation of γ-TiAl based alloys. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 329-331, pp. 177 - 183 (2002)

Palm, M.; Zhang, L.; Stein, F.; Sauthoff, G.: Phases and phase equilibria in the Al-rich part of the Al–Ti system above 900 °C. Intermetallics 10 (6), pp. 523 - 540 (2002)

Raabe, D.: Don’t trust your simulation - Computational materials science on its way to maturity? Advanced Engineering Materials 4 (5), pp. 255 - 267 (2002)

Dehm, G.; Balk, T. J.; von Blanckenhagen, B.; Gumbsch, P.; Arzt, E.: Dislocation dynamics in sub-micron confinement: recent progress in Cu thin film plasticity. Zeitschrift für Metallkunde/Materials Research and Advanced Techniques 93 (5), pp. 383 - 391 (2002)

Schillinger, W.; Clemens, H.; Dehm, G.; Bartels, A.: Microstructural stability and creep behavior of a lamellar γ-TiAl based alloy with extremely fine lamellar spacing. Intermetallics 10 (5), pp. 459 - 466 (2002)

Rebhan, M. E.; Plagge, A.; Rohwerder, M.; Stratmann, M.: Self-assembly of aminosilane films on silicidized iron. Langmuir 18 (7), pp. 2577 - 2581 (2002)

Bartels, A.; Clemens, H.; Dehm, G.; Lach, E.; Schillinger, W.: Strain rate dependence of the deformation mechanisms in a fully lamellar γ-TiAl-based alloy. Zeitschrift für Metallkunde/Materials Research and Advanced Techniques 93 (3), pp. 180 - 185 (2002)

Dehm, G.; Wagner, T. A.; Balk, T. J.; Arzt, E.; Inkson, B. J.: Plasticity and interfacial dislocation mechanisms in epitaxial and polycrystalline Al films constrained by substrates. Journal of Materials Science & Technology 18 (2), pp. 113 - 117 (2002)