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Journal Article (3)
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1.Journal ArticleAdhesion measurement of a buried Cr interlayer on polyimide. Philosophical Magazine 95 (16-18), pp. 1982 - 1991 (2015)
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2.Journal ArticleThermal stresses and microstructure of tungsten films on copper. BHM Berg- und Hüttenmännische Monatshefte 153 (7), pp. 273 - 277 (2008)
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3.Journal ArticleSize-independent stresses in Al thin films thermally strained down to -100°C. Acta Materialia 55 (6), pp. 1941 - 1946 (2007)
Talk (1)
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4.TalkThe adhesion of a Cu/Cr film stack on polyimide. EUROMAT2013, Sevilla, Spain (2013)
Poster (1)
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5.PosterAdhesion behavior of Cu–Cr thin films on polyimide substrate. ECI Conference "Nano- and Micro-Mechanical Testing in Materials Research and Development IV", Olhão, Portugal (2013)