Search results

Journal Article (3)

1. 1.
   MPG.PuRe

   DOI
   Journal Article

   Marx, V. M.; Kirchlechner, C.; Zizak, I.; Cordill, M. J.; Dehm, G.: Adhesion measurement of a buried Cr interlayer on polyimide. Philosophical Magazine 95 (16-18), pp. 1982 - 1991 (2015)
2. 2.
   MPG.PuRe

   DOI
   Journal Article

   Kapp, M.; Martinschitz, K. J.; Kečkéš, J.; Lackner, J.M.; Zizak, I.; Dehm, G.: Thermal stresses and microstructure of tungsten films on copper. BHM Berg- und Hüttenmännische Monatshefte 153 (7), pp. 273 - 277 (2008)
3. 3.
   MPG.PuRe

   DOI
   Journal Article

   Eiper, E.; Kečkéš, J.; Martinschitz, K. J.; Zizak, I.; Cabié, M.; Dehm, G.: Size-independent stresses in Al thin films thermally strained down to -100°C. Acta Materialia 55 (6), pp. 1941 - 1946 (2007)

Talk (1)

1. 4.
   MPG.PuRe
   Talk

   Marx, V. M.; Kirchlechner, C.; Zizak, I.; Cordill, M. J.; Dehm, G.: The adhesion of a Cu/Cr film stack on polyimide. EUROMAT2013, Sevilla, Spain (2013)

Poster (1)

1. 5.
   MPG.PuRe
   Poster

   Marx, V. M.; Kirchlechner, C.; Zizak, I.; Cordill, M. J.; Dehm, G.: Adhesion behavior of Cu–Cr thin films on polyimide substrate. ECI Conference "Nano- and Micro-Mechanical Testing in Materials Research and Development IV", Olhão, Portugal (2013)