Home News Short News One conference - Six awards Publications of Klaus Heckmann All genres Journal Article (1) Journal Article (1) 1. Journal Article Müller, R.; Heckmann, K.; Habermann, M.; Paul, T.; Stratmann, M.: New adhesion promoters for copper leadframes and epoxy resin. Journal of Adhesion 72 (1), pp. 65 - 83 (2000) MPG.PuRe DOI
