Publications of Christina Scheu

Zhang, W.; Li, H.; Hu, Z.; Liang, Y.; Yang, J.; Si, Z.; Clemens, H.; Scheu, C.; Dehm, G.; Cha, L.: Precipitation and growth behavior of β₀ phase in the α₂/γ lamellar colonies of an intermetallic Ti–43.5Al–4Nb–1Mo–0.1B alloy. Journal of Alloys and Compounds 1020, 179381 (2025)

Shoji Aota, L.; Jung, C.; Zhang, S.; Büyükuslu, Ö.; Saksena, A.; Hatipoglu, E.; Yadav, P.; Pratap Singh, M.; Chen, X.; Woods, E. et al.; Scheu, C.; Kim, S.-H.; Raabe, D.; Gault, B.: Grain Boundaries Control Lithiation of Solid Solution Substrates in Lithium Metal Batteries. Advanced Science 12 (4), 2409275 (2025)

Chatain, D.; Courtois, B.; Saood, S.; Dehm, G.; Scheu, C.; Badie, C.; Santinacci, L.: A potential mechanism for abnormal grain growth in Ni thin films on c-sapphire. Acta Materialia 281, 120451 (2024)

Geng, X.; Vega-Paredes, M.; Wang, Z.; Ophus, C.; Lu, P.; Ma, Y.; Zhang, S.; Scheu, C.; Liebscher, C.; Gault, B.: Grain boundary engineering for efficient and durable electrocatalysis. Nature Communications 15, 8534 (2024)

Isotta, E.; Jiang, S.; Bueno Villoro, R.; Nagahiro, R.; Maeda, K.; Mattlat, D. A.; Odufisan, A. R.; Zevalkink, A.; Shiomi, J.; Zhang, S. et al.; Scheu, C.; Snyder, G. J.; Balogun, O.: Heat Transport at Silicon Grain Boundaries. Advanced Functional Materials 34 (40), 2405413 (2024)

Jang, K.; Ko, W.-S.; Son, J.-H.; Jang, J.-I.; Kim, B.; Vega-Paredes, M.; Jang, H.; Allahyari, M.; Kim, S.-H.; Ryou, K. et al.; Chae, D.; Park, H.; Jung, Y. S.; Oh, M.-W.; Jung, C.; Scheu, C.; Choi, P.-P.: Impact of Hierarchical Dopant-Induced Microstructure on Thermoelectric Properties of p-Type Si–Ge Alloys Revealed by Comprehensive Multi-Scale Characterization. Advanced Functional Materials 34 (40), 2403785 (2024)

Kini, M. K.; Lee, S.; Savan, A.; Breitbach, B.; Ghidelli, M.; Ludwig, A.; Scheu, C.; Chatain, D.; Best, J. P.; Dehm, G.: Equiatomic CoCrFeNi Thin Films on C-Sapphire: The Role of Twins and Orientation Relationships. Advanced Engineering Materials 26 (19), 2400720 (2024)

Tehranchi, A.; Zhang, S.; Zendegani, A.; Scheu, C.; Hickel, T.; Neugebauer, J.: Metastable defect phase diagrams as roadmap to tailor chemically driven defect formation. Acta Materialia 277, 120145 (2024)

Cheng, N.; Kanzler, L.; Jiang, Y.; Mingers, A. M.; Weiss, M.; Scheu, C.; Marschall, R.; Zhang, S.: Activity and stability of ZnFe₂O₄ photoanodes under photoelectrochemical conditions. ACS Catalysis 14 (14), pp. 10789 - 10795 (2024)

Felten, M.; Lutz, A.; Aliramaji, S.; Zhang, S.; Scheu, C.; Schneider, J. M.; Zander, D.: The effect of Al on the corrosion resistance of binary Mg–Al solid solutions: Combining in-situ electrochemistry with combinatorial thin films. Electrochemistry Communications 164, 107749 (2024)

Gopalan, H.; Rao, J.; Patil, P.; Jung, C.; Kim, S.-H.; Wolff-Goodrich, S.; Wetegrove, M.; Kruth, A.; Scheu, C.; Dehm, G. et al.; Duarte, M. J.: Influence of electrochemical hydrogen charging on the mechanical, diffusional, and interfacial properties of an amorphous alumina coating on Fe‑8 wt% Cr alloy. Journal of Materials Research 39, pp. 1812 - 1821 (2024)

Felten, M.; Chaineux, V.; Zhang, S.; Tehranchi, A.; Hickel, T.; Scheu, C.; Spille, J.; Lipińska-Chwałek, M.; Mayer, J.; Berkels, B. et al.; Hans, M.; Greving, I.; Flenner, S.; Sefa, S.; Zander, D.: The effect of Laves phases and nano-precipitates on the electrochemical corrosion resistance of Mg–Al–Ca alloys under alkaline conditions. Journal of Magnesium and Alloys 12 (6), pp. 2447 - 2461 (2024)

Yu, Y.; Sheskin, A.; Wang, Z.; Uzhansky, A.; Natanzon, Y.; Dawod, M.; Abdellaoui, L.; Schwarz, T.; Scheu, C.; Wuttig, M. et al.; Cojocaru-Mirédin, O.; Amouyal, Y.; Zhang, S.: Ostwald Ripening of Ag₂Te Precipitates in Thermoelectric PbTe: Effects of Crystallography, Dislocations, and Interatomic Bonding. Advanced Engineering Materials 14 (19), 2304442 (2024)

Hieke, S. W.; Frank, A.; Duarte, M. J.; Gopalan, H.; Patil, P.; Wetegrove, M.; Rohloff, M.; Kruth, A.; Pistidda, C.; Dornheim, M. et al.; Taube, K.; Dehm, G.; Scheu, C.: Stability and Failure Mechanisms of Al₂O₃|Al Bilayer Coatings Exposed to 300 Bar Hydrogen at 673 K. Advanced Engineering Materials 26 (4), 2300619 (2024)

Neuß, D.; McCaroll, I.; Zhang, S.; Woods, E.; Delis, W. J.; Tanure, L.; Springer, H.; Sandlöbes, S.; Yang, J.; Todorova, M. et al.; Zander, D.; Scheu, C.; Schneider, J. M.; Hans, M.: High-resolution chemical and structural characterization of the native oxide scale on a Mg-based alloy. Corrosion Science 227, 111776 (2024)

Aymerich Armengol, R.; Vega-Paredes, M.; Wang, Z.; Mingers, A. M.; Camuti, L.; Kim, J.; Bae, J.; Efthimiopoulos, I.; Sahu, R.; Podjaski, F. et al.; Rabe, M.; Scheu, C.; Lim, J.; Zhang, S.: Operando Insights on the Degradation Mechanisms of Rhenium-Doped and Undoped Molybdenum Disulfide Nanocatalysts During Hydrogen Evolution Reaction and Open-Circuit Conditions. Advanced Functional Materials 35 (3), 2413720 (2024)

Geng, X.; Vega-Paredes, M.; Lu, X.; Chakraborty, P.; Li, Y.; Scheu, C.; Wang, Z.; Gault, B.: Concave Grain Boundaries Stabilized by Boron Segregation for Efficient and Durable Oxygen Reduction. Advanced Materials, 2404839 (2024)

Ying, P.; Bueno Villoro, R.; Bahrami, A.; Wilkens, L.; Reith, H.; Mattlat, D. A.; Pacheco, V.; Scheu, C.; Zhang, S.; Nielsch, K. et al.; He, R.: Performance Degradation and Protective Effects of Atomic Layer Deposition for Mg-based Thermoelectric Modules. Advanced Functional Materials 34 (45), 2406473 (2024)

Choi, J.; Yoo, S.; Koh, E. S.; Aymerich-Armengol, R.; Scheu, C.; Fortunato, G. V.; Lanza, M. R. V.; Hwang, Y. J.; Ledendecker, M.: Unlocking the Potential of Sub-Nanometer Pd Catalysts for Electrochemical Hydrogen Peroxide Production. Advanced Materials Interfaces 10 (36), 2300647 (2023)

Jung, C.; Jang, K.; Park, H.; Jang, J.; Jang, H.; Kang, B.; Park, K.; Zhang, S.; Bueno Villoro, R.; Park, S. et al.; Ryu, H. J.; Jung, Y. S.; Oh, M.-W.; Scheu, C.; Yi, S.-H.; Choi, P.-P.: Enhanced thermoelectric properties of NbCoSn half-Heuslers through in-situ nanocrystallization of amorphous precursors during the consolidation process. Journal of Materials Science & Technology 165, pp. 39 - 48 (2023)