Publications of Gerhard Dehm

Wellner, P.; Kraft, O.; Dehm, G.; Andersons, J.; Arzt, E.: Channel cracking of β-NiAl thin films on Si substrates. Acta Materialia 52 (8), pp. 2325 - 2336 (2004)

Schmidt, T.; Balk, T. J.; Dehm, G.; Arzt, E.: Influence of tantalum and silver interlayers on thermal stress evolution in copper thin films on silicon substrates. Scripta Materialia 50 (6), pp. 733 - 737 (2004)

Inkson, B. J.; Dehm, G.; Wagner, T. A.: Thermal stability of Ti and Pt nanowires manufactured by Ga⁺ focused ion beam. Journal of Microscopy 214 (3), pp. 252 - 260 (2004)

Clemens, H.; Schubert, D. W.; Dehm, G.; Scheu, C.; Buttstaedt, J. L.: Characterization of biocompatible Ti(CNO) layers on polymeric substrates. Applied Surface Science 219 (3-4), pp. 329 - 337 (2003)

Schwaiger, R.; Dehm, G.; Kraft, O.: Cyclic deformation of polycrystalline Cu films. Philosophical Magazine 83 (6), pp. 693 - 710 (2003)

Dehm, G.; Bamberger, M. S.: Laser cladding of Co-based hardfacing on Cu substrate. Journal of Materials Science 37 (24), pp. 5345 - 5353 (2002)

Dehm, G.; Inkson, B. J.; Wagner, T. A.: Growth and microstructural stability of epitaxial Al films on (0001) α-Al₂O₃ substrates. Acta Materialia 50 (20), pp. 5021 - 5032 (2002)

Inkson, B. J.; Dehm, G.; Wagner, T. A.: In-situ TEM observation of dislocation motion in thermally strained Al nanowires. Acta Materialia 50 (20), pp. 5033 - 5047 (2002)

Beschliesser, M.; Chatterjee, A.; Lorich, A.; Knabl, W.; Kestler, H.; Dehm, G.; Clemens, H.: Designed fully lamellar microstructures in a γ-TiAl based alloy: adjustment and microstructural changes upon long-term isothermal exposure at 700 and 800 degrees C. Materials Science and Engineering A-Structural Materials Properties Microstructure and Processing 329-331, pp. 124 - 129 (2002)

Marketz, W. T.; Fischer, F. D.; Kauffmann, F.; Dehm, G.; Bidlingmaier, T.; Wanner, A.; Clemens, H.: On the role of twinning during room temperature deformation of γ-TiAl based alloys. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 329-331, pp. 177 - 183 (2002)

Dehm, G.; Balk, T. J.; von Blanckenhagen, B.; Gumbsch, P.; Arzt, E.: Dislocation dynamics in sub-micron confinement: recent progress in Cu thin film plasticity. Zeitschrift für Metallkunde/Materials Research and Advanced Techniques 93 (5), pp. 383 - 391 (2002)

Schillinger, W.; Clemens, H.; Dehm, G.; Bartels, A.: Microstructural stability and creep behavior of a lamellar γ-TiAl based alloy with extremely fine lamellar spacing. Intermetallics 10 (5), pp. 459 - 466 (2002)

Bartels, A.; Clemens, H.; Dehm, G.; Lach, E.; Schillinger, W.: Strain rate dependence of the deformation mechanisms in a fully lamellar γ-TiAl-based alloy. Zeitschrift für Metallkunde/Materials Research and Advanced Techniques 93 (3), pp. 180 - 185 (2002)

Dehm, G.; Wagner, T. A.; Balk, T. J.; Arzt, E.; Inkson, B. J.: Plasticity and interfacial dislocation mechanisms in epitaxial and polycrystalline Al films constrained by substrates. Journal of Materials Science & Technology 18 (2), pp. 113 - 117 (2002)

Kobrinsky, M. J.; Dehm, G.; Thompson, C. L.; Arzt, E.: Effects of thickness on the characteristic length scale of dislocation plasticity in Ag thin films. Acta Materialia 49 (17), pp. 3597 - 3607 (2001)

Vogel, M.; Kraft, O.; Dehm, G.; Arzt, E.: Quasi-crystalline grain-boundary phase in the magnesium die- cast alloy ZA85. Scripta Materialia 45 (5), pp. 517 - 524 (2001)

Chatterjee, A.; Clemens, H.; Mecking, H.; Dehm, G.; Arzt, E.: Creep behavior of γ-TiAl-based alloys with fully lamellar microstructure. Zeitschrift für Metallkunde/Materials Research and Advanced Techniques 92 (8), pp. 1000 - 1004 (2001)

Dehm, G.; Weiss, D.; Arzt, E.: In situ transmission electron microscopy study of thermal-stress-induced dislocations in a thin Cu film constrained by a Si substrate. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 309-310, pp. 468 - 472 (2001)

Legros, M.; Dehm, G.; Keller-Flaig, R.-M.; Arzt, E.; Hemker, K. J.; Süresh, S.: Dynamic observation of Al thin films plastically strained in a TEM. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 309-310, pp. 463 - 467 (2001)

Scheu, C.; Dehm, G.; Kaplan, W. D.: Equilibrium amorphous silicon-calcium-oxygen films at interfaces in copper-alumina composites prepared by melt infiltration. Journal of the American Ceramic Society 84 (3), pp. 623 - 630 (2001)