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Journal Article (97)

  1. 61.
    Journal Article
    Wheeler, J. M.; Kirchlechner, C.; Micha, J.-S.; Michler, J. K.; Kiener, D.: The effect of size on the strength of FCC metals at elevated temperatures: annealed copper. Philosophical Magazine 96 (32-34), pp. 3379 - 3395 (2016)
  2. 62.
    Journal Article
    Raghavan, R.; Wheeler, J. M.; Harzer, T. P.; Chawla, V.; Djaziri, S.; Thomas, K. V.; Philippi, B.; Kirchlechner, C.; Jaya, B. N.; Wehrs, J. et al.; Michler, J.; Dehm, G.: Transition from shear to stress-assisted diffusion of copper–chromium nanolayered thin films at elevated temperatures. Acta Materialia 100, pp. 73 - 80 (2015)
  3. 63.
    Journal Article
    Imrich, P. J.; Kirchlechner, C.; Dehm, G.: Influence of inclined twin boundaries on the deformation behavior of Cu micropillars. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 642, pp. 65 - 70 (2015)
  4. 64.
    Journal Article
    Imrich, P. J.; Kirchlechner, C.; Kiener, D.; Dehm, G.: In situ TEM microcompression of single and bicrystalline samples: insights and limitations. JOM-Journal of the Minerals Metals & Materials Society 67 (8), pp. 1704 - 1712 (2015)
  5. 65.
    Journal Article
    Ziemann, M.; Chen, Y.; Wulfinghoff, S.; Kirchlechner, C.; Tamura, N.; Böhlke, T.; Walter, M. H.; Gruber, P. A.: Deformation patterns in cross-sections of twisted bamboo-structured Au microwires. Acta Materialia 97, 12194, pp. 216 - 222 (2015)
  6. 66.
    Journal Article
    Marx, V. M.; Kirchlechner, C.; Zizak, I.; Cordill, M. J.; Dehm, G.: Adhesion measurement of a buried Cr interlayer on polyimide. Philosophical Magazine 95 (16-18), pp. 1982 - 1991 (2015)
  7. 67.
    Journal Article
    Wimmer, A. C.; Heinz, W.; Leitner, A.; Detzel, T.; Robl, W.; Kirchlechner, C.; Dehm, G.: Micro-tension study of miniaturized Cu lines at variable temperatures. Acta Materialia 92, pp. 243 - 254 (2015)
  8. 68.
    Journal Article
    Marx, V. M.; Toth, F.; Wiesinger, A.; Berger, J.; Kirchlechner, C.; Cordill, M. J.; Fischer, F. D.; Rammerstorfer, F. G.; Dehm, G.: The influence of a brittle Cr interlayer on the deformation behavior of thin Cu films on flexible substrates: Experiment and model. Acta Materialia 89, pp. 278 - 289 (2015)
  9. 69.
    Journal Article
    Imrich, P. J.; Kirchlechner, C.; Kiener, D.; Dehm, G.: Internal and external stresses: in situ TEM compression of Cu bicrystals containing a twin boundary. Scripta Materialia 100, pp. 94 - 97 (2015)
  10. 70.
    Journal Article
    Kapp, M. W.; Kapp, M. W.; Kirchlechner, C.; Pippan, R.; Dehm, G.: Importance of dislocations pile-ups on the mechanical properties and the Bauschinger effect in micro cantilevers. Journal of Materials Research 30 (6), pp. 791 - 797 (2015)
  11. 71.
    Journal Article
    Jaya, B. N.; Kirchlechner, C.; Dehm, G.: Can micro-scale fracture tests provide reliable fracture toughness values? A case study in silicon. Journal of Materials Research 30 (5), pp. 686 - 698 (2015)
  12. 72.
    Journal Article
    Hoffmann, R.; Kirchlechner, C.; Langer, G.; Wochnik, A. S.; Griesshaber, E.; Schmahl, W. W.; Scheu, C.: Insight into Emiliania huxleyi coccospheres by focused ion beam sectioning. Biogeosciences 12 (12), pp. 825 - 834 (2015)
  13. 73.
    Journal Article
    Cordill, M. J.; Glushko, O.; Kreith, J.; Marx, V. M.; Kirchlechner, C.: Measuring electro-mechanical properties of thin films on polymer substrates. Microelectronic Engineering 137 (1), pp. 96 - 100 (2015)
  14. 74.
    Journal Article
    Kirchlechner, C.; Imrich, P. J.; Liegl, W.; Pörnbacher, J.; Micha, J.-S.; Ullrich, O.; Motz, C.: On the reversibility of dislocation slip during small scale low cycle fatigue. Acta Materialia 94, pp. 69 - 77 (2015)
  15. 75.
    Journal Article
    Wimmer, A. C.; Heinz, W.; Detzel, T.; Robl, W.; Nellessen, M.; Kirchlechner, C.; Dehm, G.: Cyclic bending experiments on freestanding Cu micron lines observed by EBSD. Acta Materialia 83, pp. 460 - 469 (2015)
  16. 76.
    Journal Article
    Cordill, M. J.; Marx, V. M.; Kirchlechner, C.: Ductile film delamination from compliant substrates using hard overlayers. Thin Solid Films 571 (P2), pp. 302 - 307 (2014)
  17. 77.
    Journal Article
    Abboud, A.; Kirchlechner, C.; Send, S.; Micha, J.-S.; Ulrich, O.; Pashniak, N.; Strüder, L. W.; Kečkéš, J.; Pietsch, U.: A new method for polychromatic X-ray μLaue diffraction on a Cu pillar using an energy-dispersive pn-junction charge-coupled device. Review of Scientific Instruments 85 (11), 113901 (2014)
  18. 78.
    Journal Article
    Vaxelaire, N.; Labat, S.; Cornelius, T. W.; Kirchlechner, C.; Kečkéš, J.; Schulli, T. U.; Thomas, O.: New insights into single-grain mechanical behavior from temperature-dependent 3-D coherent X-ray diffraction. Acta Materialia 78, pp. 46 - 55 (2014)
  19. 79.
    Journal Article
    Imrich, P. J.; Kirchlechner, C.; Motz, C.; Dehm, G.: Differences in deformation behavior of bicrystalline Cu micropillars containing a twin boundary or a large-angle grain boundary. Acta Materialia 73, pp. 240 - 250 (2014)
  20. 80.
    Journal Article
    Glushko, O.; Marx, V. M.; Kirchlechner, C.; Zizak, I.; Cordill, M. J.: Recovery of electrical resistance in copper films on polyethylene terephthalate subjected to a tensile strain. Thin Solid Films 552 (3), pp. 141 - 145 (2014)
 
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