Alle Typen
1.
Zeitschriftenartikel
8, 100503 (2019)
Au–Sn solders applied in transient liquid phase bonding: Microstructure and mechanical behavior. Materialia 2.
Vortrag
Pathways for reliable lead-free solder joints: micro-fracture properties of Au-Sn based solder. European solid mechanics conference (ESMC) 2018, Bologna, Italy (2018)