Publikationen von Sutatch Ratanaphan

Ratanaphan, S.; Raabe, D.; Sarochawikasit, R.; Olmsted, D. L.; Rohrer, G. S.; Tu, K.: Grain boundary character distribution in electroplated nanotwinned copper. Journal of Materials Science 52 (7), S. 4070 - 4085 (2017)

Ratanaphan, S.; Xu, D.; Xu, L.; Raabe, D.; Tu, K.: Grain Boundary Engineering in Copper Through-via Silicon Interconnects. MRS Fall Conference 2008, Boston, MA, USA (2008)