Zhang, D.; Dehm, G.; Clemens, H.: On the microstructural evolution and phase transformation in a high niobium containing γ-TiAl alloy. Zeitschrift für Metallkunde 91 (11), S. 950 - 956 (2000)
Chatterjee, A.; Dehm, G.; Scheu, C.; Clemens, H.: Onset of microstructural instability in a fully lamellar Ti-46.5 at.% Al-4 al.% (Cr,Nb,Ta,B) alloy during short-term creep. Zeitschrift für Metallkunde/Materials Research and Advanced Techniques 91 (9), S. 755 - 760 (2000)
Dehm, G.; Arzt, E.: In-situ transmission electron microscopy study of dislocations in a polycrystalline Cu thin film constrained by a substrate. Applied Physics Letters 77 (8), S. 1126 - 1128 (2000)
Zhang, D.; Dehm, G.; Clemens, H.: Effect of heat treatments and hot-isostatic pressing on phase transformations and microstructure in a β/B2 containing γ-TiAl based alloy. Scripta Materialia 42 (11), S. 1065 - 1070 (2000)
Dehm, G.; Scheu, C.; Bamberger, M. S.: Microstructure of Iron Substrates Borided with Ni2B Particles by Laser-Induced Surface-Alloying. Zeitschrift für Metallkunde 90 (11), S. 920 - 929 (1999)
Bidlingmaier, T.; Wanner, A.; Dehm, G.; Clemens, H.: Acoustic Emission during Room Temperature Deformation of a γ-TiAl Based Alloy. Zeitschrift für Metallkunde 90, S. 581 - 587 (1999)
Dehm, G.; Scheu, C.; Rühle, M.; Raj, R.: Growth and Structure of Internal Cu/Al2O3 and Cu/Ti/Al2O3 Interfaces. Acta Materialia 46 (3), S. 759 - 772 (1998)
Scheu, C.; Dehm, G.; Kaplan, W. D.; Wagner, F.; Claussen, N. E.: Microstructure and Phase Evolution of Niobium-Aluminide-Alumina Composites Prepared by Melt-Infiltration. Physica Status Solidi A 166 (1), S. 241 - 255 (1998)
Dehm, G.; Scheu, C.; Möbus, G.; Brydson, R.; Rühle, M.: Synthesis of Analytical and High Resolution Transmission Electron Microscopy to Determine the Interface Structure of Cu/Al2O3. Ultramicroscopy 67 (1-4), S. 207 - 217 (1997)
Dehm, G.; Rühle, M.; Conway, H. D.; Raj, R.: A microindentation method for estimating interfacial shear strength and its use in studying the influence of titanium transition layers on the interface strength of epitaxial copper films on sapphire. Acta Materialia 45 (2), S. 489 - 499 (1997)