Publikationen von Hanna Bishara

Best, J. P.; Kanjilal, A.; Ghafarollahi, A.; Rehman, U.; Tian, C.; Bishara, H.; Bhat, M. K.; Christiansen, L.; Bitzek, E.; Stein, F. et al.; Dehm, G.: Fracture of the C15 CaAl₂ Laves phase at small length scales. Journal of Materials Science 59, S. 12677 - 12694 (2024)

Bishara, H.; Langenohl, L.; Zhou, X.; Gault, B.; Best, J. P.; Dehm, G.: Decoupling the electrical resistivity contribution of grain boundaries in dilute Fe-alloyed Cu thin films. Scripta Materialia 230, 115393 (2023)

Bueno Villoro, R.; Wood, M.; Luo, T.; Bishara, H.; Abdellaoui, L.; Zavanelli, D.; Gault, B.; Snyder, G. J.; Scheu, C.; Zhang, S.: Fe segregation as a tool to enhance electrical conductivity of grain boundaries in Ti(Co,Fe)Sb half Heusler thermoelectrics. Acta Materialia 249, 118816 (2023)

Brink, T.; Langenohl, L.; Bishara, H.; Dehm, G.: Universality of grain boundary phases in fcc metals: Case study on high-angle [111] symmetric tilt grain boundaries. Physical Review B 107 (5), 054103 (2023)

Kaiser, T.; Dehm, G.; Kirchlechner, C.; Menzel, A.; Bishara, H.: Probing porosity in metals by electrical conductivity: Nanoscale experiments and multiscale simulations. European Journal of Mechanics - A/Solid 97, 104777 (2023)

Bishara, H.; Kontis, P.; Dehm, G.; Schneider, J. M.; Evertz, S.: Effect of hybridization in PdAlY-(Ni/Au/Ir) metallic glasses thin films on electrical resistivity. Scripta Materialia 214, 114681 (2022)

Bishara, H.; Tsybenko, H.; Nandy, S.; Muhammad, Q. K.; Frömling, T.; Fang, X.; Best, J. P.; Dehm, G.: Dislocation-enhanced electrical conductivity in rutile TiO₂ accessed by room-temperature nanoindentation. Scripta Materialia 212, 114543 (2022)

Gomell, L.; Haeger, T.; Roscher, M.; Bishara, H.; Heiderhoff, R.; Riedl, T.; Scheu, C.; Gault, B.: Microstructure manipulation by laser-surface remelting of a full-Heusler compound to enhance thermoelectric properties. Acta Materialia 223, 117501 (2022)

Bishara, H.; Lee, S.; Brink, T.; Ghidelli, M.; Dehm, G.: Understanding Grain Boundary Electrical Resistivity in Cu: The Effect of Boundary Structure. ACS Nano 15 (10), S. 16607 - 16615 (2021)

Devulapalli, V.; Bishara, H.; Ghidelli, M.; Dehm, G.; Liebscher, C.: Influence of substrates and e-beam evaporation parameters on the microstructure of nanocrystalline and epitaxially grown Ti thin films. Applied Surface Science 562, 150194 (2021)

Luo, T.; Serrano Sanchez, F. M.; Bishara, H.; Zhang, S.; Bueno Villoro, R.; Kuo, J. J.; Felser, C.; Scheu, C.; Snyder, G. J.; Best, J. P. et al.; Dehm, G.; Yu, Y.; Raabe, D.; Fu, C.; Gault, B.: Dopant-segregation to grain boundaries controls electrical conductivity of η-type NbCo(Pt)Sn half-Heusler alloy mediating thermoelectric performance. Acta Materialia 217, 117147 (2021)

Fang, X.; Bishara, H.; Ding, K.; Tsybenko, H.; Porz, L.; Höfling, M.; Bruder, E.; Li, Y.; Dehm, G.; Durst, K.: Nanoindentation pop‐in in oxides at room temperature: dislocation activation or crack formation? Journal of the American Ceramic Society 104 (9), S. 4728 - 4741 (2021)

Gomell, L.; Roscher, M.; Bishara, H.; Jägle, E. A.; Scheu, C.; Gault, B.: Properties and influence of microstructure and crystal defects in Fe₂VAl modified by laser surface remelting. Scripta Materialia 193, S. 153 - 157 (2021)

Bishara, H.; Ghidelli, M.; Dehm, G.: Approaches to Measure the Resistivity of Grain Boundaries in Metals with High Sensitivity and Spatial Resolution: A Case Study Employing Cu. ACS Applied Electronic Materials 2 (7), S. 2049 - 2056 (2020)

Bishara, H.; Stein, F.: Mo–Nb–V (Molybdenum-Niobium-Vanadium). In: Refractory Material Systems for Industrial Applications, Bd. 22, S. 366 - 377 (Hg. Seifert, H. J.; Kumar, K. C. H.). MSI, Materials Science International Services GmbH, Stuttgart (2024)

Bishara, H.; Yesilcicek, Y.; Stein, F.: Nb–Ni–V Ternary Phase Diagram Evaluation. In: Refractory Material Systems for Industrial Applications, S. 450 - 464 (Hg. Seifert, H. J.; Kumar, K. C. H.). MSI, Materials Science International Services GmbH, Stuttgart, Germany (2024)

Best, J. P.; Rehman, U.; Tian, C.; Bishara, H.; Bhat, M. K.; Christiansen, L.; Stein, F.; Dehm, G.: Microscale Fracture Toughness Investigation of the Caal2 C15 Laves Phase. SSRN Conference Paper Series, (2023)

Dehm, G.; Langenohl, L.; Ahmad, S.; Ahmadian, A.; Frolov, T.; Duarte, M. J.; Richter, G.; Zhou, X.; Gault, B.; Bishara, H. et al.; Brink, T.; Liebscher, C.: Resolving grain boundary complexions in Copper by STEM and analyzing their impact on properties. Workshop Advanced Electron Microscopy in Materials Research, La Clusaz, France (2023)

Dehm, G.; Langenohl, L.; Bishara, H.; Brink, T.; Liebscher, C.: Atomic structure and phase stability of Cu tilt grain boundaries resolved by scanning transmission electron microscopy. Materials Science and Engineering MSE Congress, Darmstadt, Germany (2022)

Bueno Villoro, R.; Wood, M.; Luo, T.; Bishara, H.; Abdellaoui, L.; Zavanelli, D.; Gault, B.; Snyder, G. J.; Scheu, C.; Zhang, S.: Effect of grain boundaries on electrical conductivity in Ti(Co,Fe)Sb half Heusler thermoelectrics. European Conference on Thermoelectrics (ECT), Barcelona, Spain (2022)