Publikationen von Thomas John Balk

Zeitschriftenartikel (6)

Legros, M.; Kaouache, B.; Gergaud, P.; Thomas, O.; Dehm, G.; Balk, T. J.; Arzt, E.: Pipe-diffusion ripening of Si precipitates in Al-0.5% Cu-1%Si thin films. Philosophical Magazine 85 (30), S. 3541 - 3552 (2005)
Girgsdies, F.; Ressler, T.; Wild, U.; Wübben, T.; Balk, T. J.; Dehm, G.; Zhou, L.; Günther, S.; Arzt, E.; Imbihl, R. et al.; Schlögl, R.: Strained thin copper films as model catalysts in the materials gap. Catalysis Letters 102 (1-2), S. 91 - 97 (2005)
Sauter, L. X.; Balk, T. J.; Dehm, G.; Nucci, J.; Arzt, E.: Hillock Formation and Thermal Stresses in Thin Au Films on Si Substrates. Materials Research Society Symposium Proceedings 875, O5.2, S. 177 - 182 (2005)
Schmidt, T.; Balk, T. J.; Dehm, G.; Arzt, E.: Influence of tantalum and silver interlayers on thermal stress evolution in copper thin films on silicon substrates. Scripta Materialia 50 (6), S. 733 - 737 (2004)
Dehm, G.; Balk, T. J.; von Blanckenhagen, B.; Gumbsch, P.; Arzt, E.: Dislocation dynamics in sub-micron confinement: recent progress in Cu thin film plasticity. Zeitschrift für Metallkunde/Materials Research and Advanced Techniques 93 (5), S. 383 - 391 (2002)
Dehm, G.; Wagner, T. A.; Balk, T. J.; Arzt, E.; Inkson, B. J.: Plasticity and interfacial dislocation mechanisms in epitaxial and polycrystalline Al films constrained by substrates. Journal of Materials Science & Technology 18 (2), S. 113 - 117 (2002)

Konferenzbeitrag (5)

Wiederhirn, G.; Balk, T. J.; Dehm, G.; Nucci, J. A.; Richter, G.; Arzt, E.: Passivation Effects in Copper Thin Films. 8th International Workshop on Stress-Induced Phenomena in Metallization, Dresden; Germany, 12. September 2005 - 14. September 2005. AIP Conference Proceedings 817, S. 185 - 191 (2006)
Legros, M.; Dehm, G.; Balk, T. J.: In-Situ TEM Study of Plastic Stress Relaxation Mechanisms and Interface Effects in Metallic Films. In: MRS Proceedings, Bd. 875. 2005 MRS Spring Meeting. (2005)
Dehm, G.; Balk, T. J.; Edongué, H.; Arzt, E.: Small-scale plasticity in thin Cu and Al films. Materials for Advanced Metallization 2003, La Londe Les Maures, France, 09. März 2003 - 12. März 2003. Microelectronic Engineering 70 (2-4), S. 412 - 424 (2003)
Legros, M.; Dehm, G.; Balk, T. J.; Arzt, E.; Bostrom, J. R. O.; Gergaud, P.; Thomas, O.; Kaouache, B.: Plasticity - related phenomena in metallic films on substrates. In: Materials Research Society Symposium - Proceedings, Bd. 779, S. 63 - 74. Materials Research Society Symposium W – Multiscale Phenomena in Materials - Experiments and Modeling Related to Mechanical Behavior, San Francisco, CA, USA, 22. April 2003 - 24. April 2003. (2003)
Balk, T. J.; Dehm, G.; Arzt, E.: A New Type of Dislocation Mechanism in Ultrathin Copper Films. In: Materials Research Society Symposium - Proceedings, Bd. 695, S. 53 - 58. Materials Research Society Symposium L - Thin Films: Stresses and Mechanical Properties IX, Boston, MA, USA, 26. November 2001 - 30. November 2001. (2002)
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