Publikationen von Gerhard Dehm

Malyar, N.; Micha, J.-S.; Dehm, G.; Kirchlechner, C.: Dislocation-twin boundary interaction in small scale Cu bi-crystals loaded in different crystallographic directions. Acta Materialia 129, S. 91 - 97 (2017)

Malyar, N.; Micha, J.-S.; Dehm, G.; Kirchlechner, C.: Size effect in bi-crystalline micropillars with a penetrable high angle grain boundary. Acta Materialia 129, S. 312 - 320 (2017)

Palm, M.; Stein, F.; Dehm, G.: Entwicklung intermetallischer Eisenaluminid-Legierungen. Stahl und Eisen 137 (5), S. 76 - 76 (2017)

Peter, N. J.; Liebscher, C.; Kirchlechner, C.; Dehm, G.: Beam-induced atomic migration at Ag-containing nanofacets at an asymmetric Cu grain boundary. Journal of Materials Research 32 (5), S. 968 - 982 (2017)

Philippi, B.; Matoy, K.; Zechner, J.; Kirchlechner, C.; Dehm, G.: Microcantilever Fracture Testing of Intermetallic Cu₃Sn in Lead-Free Solder Interconnects. Journal of Electronic Materials 46 (3), S. 1607 - 1611 (2017)

Raghavan, R.; Kirchlechner, C.; Jaya, B. N.; Feuerbacher, M.; Dehm, G.: Mechanical size effects in a single crystalline equiatomic FeCrCoMnNi high entropy alloy. Scripta Materialia 129, S. 52 - 55 (2017)

Marx, V. M.; Cordill, M. J.; Többens, D. M.; Kirchlechner, C.; Dehm, G.: Effect of annealing on the size dependent deformation behavior of thin cobalt films on flexible substrates. Thin Solid Films 624, S. 34 - 40 (2017)

Venkatesan, S.; Mancabelli, T.; Krogstrup, P.; Hartschuh, A.; Dehm, G.; Scheu, C.: Surface optical phonon propagation in defect modulated nanowires. Journal of Applied Physics 121 (8), 085702, S. 1 - 6 (2017)

Harzer, T. P.; Duarte, M. J.; Dehm, G.: In–situ TEM study of diffusion kinetics and electron irradiation effects on the Cr phase separation of a nanocrystalline Cu–4 at.% Cr thin film alloy. Journal of Alloys and Compounds 695, S. 1583 - 1590 (2017)

Harzer, T. P.; Dehm, G.: Stability, phase separation and oxidation of a supersaturated nanocrystalline Cu–33 at.% Cr thin film alloy. Thin Solid Films 623, S. 48 - 58 (2017)

Kirchlechner, C.; Toth, F.; Rammerstorfer, F. G.; Fischer, F. D.; Dehm, G.: Pre- and post-buckling behavior of bi-crystalline micropillars: Origin and consequences. Acta Materialia 124, S. 195 - 203 (2017)

Brinckmann, S.; Kirchlechner, C.; Dehm, G.: Stress intensity factor dependence on anisotropy and geometry during micro-fracture experiments. Scripta Materialia 127, S. 76 - 78 (2017)

Duarte, M. J.; Kostka, A.; Crespo, D.; Jimenez, J. A.; Dippel, A. C.; Renner, F. U.; Dehm, G.: Kinetics and crystallization path of a Fe-based metallic glass alloy. Acta Materialia 127, S. 341 - 350 (2017)

Gleich, S.; Fager, H.; Bolvardi, H.; Achenbach, J.-O.; Soler, R.; Pradeep, K. G.; Schneider, J. M.; Dehm, G.; Scheu, C.: Nanostructure of and structural defects in a Mo₂BC hard coating investigated by transmission electron microscopy and atom probe tomography. Journal of Applied Physics 122 (7), 075305, S. 1 - 9 (2017)

Kirchlechner, C.; Djaziri, S.; Li, Y.; Herbig, M.; Grabowski, B.; Nematollahi, G. A.; Goto, S.; Kirchheim, R.; Neugebauer, J.; Raabe, D. et al.; Dehm, G.: Konkurrenzlose Festigkeit durch extremes Umformen von Stahl. Stahl und Eisen 137 (8), S. 58 - 58 (2017)

Pizzutilo, E.; Freakley, S. J.; Cherevko, S.; Venkatesan, S.; Hutchings, G. J.; Liebscher, C.; Dehm, G.; Mayrhofer, K. J. J.: Gold-Palladium Bimetallic Catalyst Stability: Consequences for Hydrogen Peroxide Selectivity. ACS Catalysis 7 (9), S. 5699 - 5705 (2017)

Raghavan, R.; Harzer, T. P.; Djaziri, S.; Hieke, S. W.; Kirchlechner, C.; Dehm, G.: Maintaining strength in supersaturated copper–chromium thin films annealed at 0.5 of the melting temperature of Cu. Journal of Materials Science 52 (2), S. 913 - 920 (2017)

Marx, V. M.; Kirchlechner, C.; Breitbach, B.; Cordill, M. J.; Többens, D. M.; Waitz, T.; Dehm, G.: Strain-induced phase transformation of a thin Co film on flexible substrates. Acta Materialia 121, S. 227 - 233 (2016)

Hahn, R.; Bartosik, M.; Soler, R.; Kirchlechner, C.; Dehm, G.; Mayrhofer, P. H.: Superlattice effect for enhanced fracture toughness of hard coatings. Scripta Materialia 124, S. 67 - 70 (2016)

Philippi, B.; Matoy, K.; Zechner, J.; Kirchlechner, C.; Dehm, G.: Fracture toughness of intermetallic Cu₆Sn₅ in lead-free solder microelectronics. Scripta Materialia 123, S. 38 - 41 (2016)