Publikationen von Gerhard Dehm

Gleich, S.; Soler, R.; Fager, H.; Bolvardi, H.; Achenbach, J.-O.; Hans, M.; Primetzhofer, D.; Schneider, J. M.; Dehm, G.; Scheu, C.: Modifying the nanostructure and the mechanical properties of Mo₂BC hard coatings: Influence of substrate temperature during magnetron sputtering. Materials and Design 142, S. 203 - 211 (2018)

Guo, J.; Haberfehlner, G.; Rosalie, J.; Li, L.; Duarte, M. J.; Kothleitner, G.; Dehm, G.; He, Y.; Pippan, R.; Zhang, Z.: In-situ atomic-scale observation of oxidation and decomposition processes in nanocrystalline alloys. Nature Communications 9, 946, S. 1 - 9 (2018)

Liebscher, C.; Yao, M.; Dey, P.; Lipińska-Chwalek, M.; Lipińska-Chwalek, M.; Berkels, B.; Gault, B.; Hickel, T.; Herbig, M.; Mayer, J. et al.; Neugebauer, J.; Raabe, D.; Dehm, G.; Scheu, C.: Tetragonal fcc-Fe induced by κ-carbide precipitates: Atomic scale insights from correlative electron microscopy, atom probe tomography, and density functional theory. Physical Review Materials 2, 023804, S. 1 - 6 (2018)

Dehm, G.; Jaya, B. N.; Raghavan, R.; Kirchlechner, C.: Overview on micro- and nanomechanical testing: New Insights in Interface Plasticity and Fracture at Small Length Scales. Acta Materialia 142, S. 248 - 282 (2018)

Oellers, T.; Raghavan, R.; Chaakraborty, J.; Kirchlechner, C.; Kostka, A.; Liebscher, C.; Dehm, G.; Ludwig, A.: Microstructure and mechanical properties in the thin film system Cu–Zr. Thin Solid Films 645, S. 193 - 202 (2018)

Jaya, B. N.; Goto, S.; Richter, G.; Kirchlechner, C.; Dehm, G.: Fracture behavior of nanostructured heavily cold drawn pearlitic steel wires before and after annealing. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 707, S. 164 - 171 (2017)

Hieke, S. W.; Dehm, G.; Scheu, C.: Annealing induced void formation in epitaxial Al thin films on sapphire (α-Al₂O₃). Acta Materialia 140, S. 355 - 365 (2017)

Zhang, Z.; Guo, J.; Dehm, G.; Pippan, R.: In-situ tracking the structural and chemical evolution of nanostructured CuCr alloys. Acta Materialia 138, S. 42 - 51 (2017)

Brinckmann, S.; Matoy, K.; Kirchlechner, C.; Dehm, G.: On the influence of microcantilever pre-crack geometries on the apparent fracture toughness of brittle materials. Acta Materialia 136, S. 281 - 287 (2017)

Malyar, N.; Dehm, G.; Kirchlechner, C.: Strain rate dependence of the slip transfer through a penetrable high angle grain boundary in copper. Scripta Materialia 138, S. 88 - 91 (2017)

Raabe, D.; Dehm, G.; Neugebauer, J.; Rohwerder, M.: 100 years public–private partnership in metallurgical and materials science research. Materials Today 20 (7), S. 335 - 337 (2017)

Toth, F.; Kirchlechner, C.; Fischer, F. D.; Dehm, G.; Rammerstorfer, F. G.: Compressed Bi-crystal micropillars showing a sigmoidal deformation state – A computational study. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 700, S. 168 - 174 (2017)

Hieke, S. W.; Breitbach, B.; Dehm, G.; Scheu, C.: Microstructural evolution and solid state dewetting of epitaxial Al thin films on sapphire (α-Al₂O₃). Acta Materialia 133, S. 356 - 366 (2017)

Liebscher, C.; Freysoldt, C.; Dennenwaldt, T.; Harzer, T. P.; Dehm, G.: Electronic structure of metastable bcc Cu–Cr alloy thin films: Comparison of electron energy-loss spectroscopy and first-principles calculations. Ultramicroscopy 178, S. 96 - 104 (2017)

Choi, W. S.; Sandlöbes, S.; Malyar, N.; Kirchlechner, C.; Korte-Kerzel, S.; Dehm, G.; De Cooman, B. C.; Raabe, D.: Dislocation interaction and twinning-induced plasticity in face-centered cubic Fe–Mn–C micro-pillars. Acta Materialia 132, S. 162 - 173 (2017)

Malyar, N.; Micha, J.-S.; Dehm, G.; Kirchlechner, C.: Dislocation-twin boundary interaction in small scale Cu bi-crystals loaded in different crystallographic directions. Acta Materialia 129, S. 91 - 97 (2017)

Malyar, N.; Micha, J.-S.; Dehm, G.; Kirchlechner, C.: Size effect in bi-crystalline micropillars with a penetrable high angle grain boundary. Acta Materialia 129, S. 312 - 320 (2017)

Palm, M.; Stein, F.; Dehm, G.: Entwicklung intermetallischer Eisenaluminid-Legierungen. Stahl und Eisen 137 (5), S. 76 - 76 (2017)

Peter, N. J.; Liebscher, C.; Kirchlechner, C.; Dehm, G.: Beam-induced atomic migration at Ag-containing nanofacets at an asymmetric Cu grain boundary. Journal of Materials Research 32 (5), S. 968 - 982 (2017)

Philippi, B.; Matoy, K.; Zechner, J.; Kirchlechner, C.; Dehm, G.: Microcantilever Fracture Testing of Intermetallic Cu₃Sn in Lead-Free Solder Interconnects. Journal of Electronic Materials 46 (3), S. 1607 - 1611 (2017)