Suchergebnisse

Philippi, B.; Matoy, K.; Zechner, J.; Kirchlechner, C.; Dehm, G.: Microcantilever Fracture Testing of Intermetallic Cu₃Sn in Lead-Free Solder Interconnects. Journal of Electronic Materials 46 (3), S. 1607 - 1611 (2017)

Philippi, B.; Matoy, K.; Zechner, J.; Kirchlechner, C.; Dehm, G.: Fracture toughness of intermetallic Cu₆Sn₅ in lead-free solder microelectronics. Scripta Materialia 123, S. 38 - 41 (2016)

Philippi, B.; Kirchlechner, C.; Micha, J.-S.; Dehm, G.: Size and orientation dependent mechanical behavior of body-centered tetragonal Sn at 0.6 of the melting temperature. Acta Materialia 115, S. 76 - 82 (2016)

Raghavan, R.; Wheeler, J. M.; Harzer, T. P.; Chawla, V.; Djaziri, S.; Thomas, K. V.; Philippi, B.; Kirchlechner, C.; Jaya, B. N.; Wehrs, J. et al.; Michler, J.; Dehm, G.: Transition from shear to stress-assisted diffusion of copper–chromium nanolayered thin films at elevated temperatures. Acta Materialia 100, S. 73 - 80 (2015)

Raghavan, R.; Harzer, T. P.; Chawla, V.; Djaziri, S.; Philippi, B.; Wehrs, J.; Wheeler, J. M.; Michler, J.; Dehm, G.: Comparing small scale plasticity of copper-chromium nanolayered and alloyed thin films at elevated temperatures. Acta Materialia 93, 12073, S. 175 - 186 (2015)

Schüler, K.; Philippi, B.; Weinmann, M.; Marx, V. M.; Vehoff, H.: Effects of processing on texture, internal stresses and mechanical properties during the pulsed electrodeposition of nanocrystalline and ultrafine-grained nickel. Acta Materialia 61 (11), S. 3945 - 3955 (2013)

Raghavan, R.; Wheeler, J. M.; Esqué-de los Ojos, D.; Thomas, K.; Almandoz, E.; Fuentes, G.; Harzer, T. P.; Chawla, V.; Djaziri, S.; Philippi, B. et al.; Wehrs, J.; Michler, J.; Dehm, G.: Thermo-mechanical behavior of nanolayered thin films. 9th European Solid Mechanics Conference (ESMC 2015), Leganés-Madrid, Spain (2015)

Raghavan, R.; Wheeler, J. M.; Harzer, T. P.; Chawla, V.; Djaziri, S.; Thomas, K.; Philippi, B.; Wehrs, J.; Michler, J.; Dehm, G.: Mechanical behavior of nanolayered thin films: Interface control. 3rd General Meeting of the GDRi CNRS "Mechanics of Nano-objects", Empa, Thun, Switzerland (2014)

Philippi, B.; Schießl, A.; Schingale, A.; Dehm, G.: Micromechanical investigation of lead-free solder joints in microelectronics. TMS 2014, San Diego, CA, USA (2014)

Philippi, B.; Schießl, A.; Schingale, A.; Dehm, G.: Micromechanical testing of lead-free solder joints in microelectronics. Arbeitskreistreffen Rasterkraftmikroskopie und nanomechanische Methoden, MPI für Eisenforschung GmbH, Düsseldorf, Deutschland (2014)

Philippi, B.; Schießl, A.; Schingale, A.; Dehm, G.: Micromechanical investigation of solder joints in automotive microelectronics. Euromat 2013, Sevilla, Spanien (2013)

Philippi, B.; Kirchlechner, C.; Schießl, A.; Schingale, A.; Dehm, G.: Improving lead-free solders by resolving mechanical properties at the microstructure length scale. Thin Film & Small Scale Mechanical Behavior 2014, Gordon Research Conference, Waltham, MA, USA (2014)

Philippi, B.; Schießl, A.; Schingale, A.; Dehm, G.: Micromechanical investigation of solder joints in automotive microelectronics. GDRi CNRS MECANO General Meeting on the Mechanics of Nano-Objects, MPIE, Düsseldorf, Germany (2013)

Philippi, B.; Schießl, A.; Schingale, A.; Dehm, G.: Micromechanical investigation of solder joints for automotive microelectronics. Nano- and Micromechanical Testing in Materials Research and Development IV, Olhão Algarve, Portugal (2013)

Philippi, B.; Schießl, A.; Schingale, A.; Dehm, G.: Micromechanical investigation of lead-free solder joints in microelectronics. Small Scale Plasticity School, Cargèse, Korsika, France (2013)

Philippi, B.; Dehm, G.: Thermo-mechanical investigation of lead-free solder. GDRi MECANO General Meeting 2012, Ecole de Mines, Paris, France (2012)

Philippi, B.: Micromechanical characterization of lead-free solder and its individual microstructure elements. Dissertation, Fakultät für Maschnenbau, RUB, Bochum, Germany (2016)