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Zeitschriftenartikel (6)
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1.ZeitschriftenartikelMicrocantilever Fracture Testing of Intermetallic Cu3Sn in Lead-Free Solder Interconnects. Journal of Electronic Materials 46 (3), S. 1607 - 1611 (2017)
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2.ZeitschriftenartikelFracture toughness of intermetallic Cu6Sn5 in lead-free solder microelectronics. Scripta Materialia 123, S. 38 - 41 (2016)
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3.ZeitschriftenartikelSize and orientation dependent mechanical behavior of body-centered tetragonal Sn at 0.6 of the melting temperature. Acta Materialia 115, S. 76 - 82 (2016)
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4.ZeitschriftenartikelTransition from shear to stress-assisted diffusion of copper–chromium nanolayered thin films at elevated temperatures. Acta Materialia 100, S. 73 - 80 (2015)
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5.ZeitschriftenartikelComparing small scale plasticity of copper-chromium nanolayered and alloyed thin films at elevated temperatures. Acta Materialia 93, 12073, S. 175 - 186 (2015)
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6.ZeitschriftenartikelEffects of processing on texture, internal stresses and mechanical properties during the pulsed electrodeposition of nanocrystalline and ultrafine-grained nickel. Acta Materialia 61 (11), S. 3945 - 3955 (2013)
Vortrag (5)
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7.VortragThermo-mechanical behavior of nanolayered thin films. 9th European Solid Mechanics Conference (ESMC 2015), Leganés-Madrid, Spain (2015)
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8.VortragMechanical behavior of nanolayered thin films: Interface control. 3rd General Meeting of the GDRi CNRS "Mechanics of Nano-objects", Empa, Thun, Switzerland (2014)
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9.VortragMicromechanical investigation of lead-free solder joints in microelectronics. TMS 2014, San Diego, CA, USA (2014)
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10.VortragMicromechanical testing of lead-free solder joints in microelectronics. Arbeitskreistreffen Rasterkraftmikroskopie und nanomechanische Methoden, MPI für Eisenforschung GmbH, Düsseldorf, Deutschland (2014)
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11.VortragMicromechanical investigation of solder joints in automotive microelectronics. Euromat 2013, Sevilla, Spanien (2013)
Poster (5)
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12.PosterImproving lead-free solders by resolving mechanical properties at the microstructure length scale. Thin Film & Small Scale Mechanical Behavior 2014, Gordon Research Conference, Waltham, MA, USA (2014)
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13.PosterMicromechanical investigation of solder joints in automotive microelectronics. GDRi CNRS MECANO General Meeting on the Mechanics of Nano-Objects, MPIE, Düsseldorf, Germany (2013)
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14.PosterMicromechanical investigation of solder joints for automotive microelectronics. Nano- and Micromechanical Testing in Materials Research and Development IV, Olhão Algarve, Portugal (2013)
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15.PosterMicromechanical investigation of lead-free solder joints in microelectronics. Small Scale Plasticity School, Cargèse, Korsika, France (2013)
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16.PosterThermo-mechanical investigation of lead-free solder. GDRi MECANO General Meeting 2012, Ecole de Mines, Paris, France (2012)
Hochschulschrift - Doktorarbeit (1)
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17.Hochschulschrift - DoktorarbeitMicromechanical characterization of lead-free solder and its individual microstructure elements. Dissertation, Fakultät für Maschnenbau, RUB, Bochum, Germany (2016)