Suchergebnisse

Du, C.; Soler, R.; Völker, B.; Matoy, K.; Zechner, J.; Langer, G.; Reisinger, M.; Todt, J.; Kirchlechner, C.; Dehm, G.: Au–Sn solders applied in transient liquid phase bonding: Microstructure and mechanical behavior. Materialia 8, 100503 (2019)

Brinckmann, S.; Matoy, K.; Kirchlechner, C.; Dehm, G.: On the influence of microcantilever pre-crack geometries on the apparent fracture toughness of brittle materials. Acta Materialia 136, S. 281 - 287 (2017)

Philippi, B.; Matoy, K.; Zechner, J.; Kirchlechner, C.; Dehm, G.: Microcantilever Fracture Testing of Intermetallic Cu₃Sn in Lead-Free Solder Interconnects. Journal of Electronic Materials 46 (3), S. 1607 - 1611 (2017)

Philippi, B.; Matoy, K.; Zechner, J.; Kirchlechner, C.; Dehm, G.: Fracture toughness of intermetallic Cu₆Sn₅ in lead-free solder microelectronics. Scripta Materialia 123, S. 38 - 41 (2016)

Völker, B.; Heinz, W.; Matoy, K.; Roth, R.; Batke, J. M.; Schöberl, T.; Cordill, M. J.; Dehm, G.: Mechanical and chemical investigation of the interface between tungsten-based metallizations and annealed borophosphosilicate glass. Thin Solid Films 583, S. 170 - 176 (2015)

Völker, B.; Heinz, W.; Matoy, K.; Roth, R.; Batke, J. M.; Schöberl, T.; Scheu, C.; Dehm, G.: Interface fracture and chemistry of a tungsten-based metallization on borophosphosilicate glass. Philosophical Magazine 95 (16-18), S. 1967 - 1981 (2015)

Völker, B.; Venkatesan, S.; Heinz, W.; Matoy, K.; Roth, R.; Batke, J. M.; Cordill, M. J.; Dehm, G.: Following crack path selection in multi-film structures with weak and strong interfaces by in-situ 4-point-bending. Journal of Materials Research 30 (8), S. 1090 - 1097 (2015)

Matoy, K.; Schönherr, H.; Detzel, T.; Dehm, G.: Micron-sized fracture experiments on amorphous SiO_x films and SiO_x/SiN_x multi-layers. Thin Solid Films 518 (20), S. 5796 - 5801 (2010)

Matoy, K.; Detzel, T.; Müller , M.; Motz, C.; Dehm, G.: Interface fracture properties of thin films studied by using the micro-cantilever deflection technique. Surface and Coatings Technology 204 (6-7), S. 878 - 881 (2009)

Matoy, K.; Schönherr, H.; Detzel, T.; Schöberl, T.; Pippan, R.; Motz, C.; Dehm, G.: A comparative micro-cantilever study of the mechanical behavior of silicon based passivation films. Thin Solid Films 518 (1), S. 247 - 256 (2009)

Motz, C.; Kiener, D.; Kirchlechner, C.; Matoy, K.; Wurster, S.; Dehm, G.; Pippan, R.: Determination of micro-mechanical properties: In-situ compression, tension and fracture testing within the SEM. In: 9th Multinational Microscopy Conference 2009, S. 501 - 502 (Hg. Kothleitner, G.; Leisch, M.). 9th Multinational Microscopy Conference 2009, Graz, Austria, 30. August 2009 - 04. September 2009. Verlag der Technischen Universität Graz, Graz, Austria (2009)

Du, C.; Matoy, K.; Zechner, J.; Reisinger, M.; Robl, W.; Hartl, R.; Kirchlechner, C.; Dehm, G.: Ni–P: Microstructure and micro-compression. Nanomechanical Testing in Materials Research and Development VII , Malaga, Spain (2019)

Du, C.; Soler, R.; Matoy, K.; Zechner, J.; Langer, G.; Kirchlechner, C.; Dehm, G.: Pathways for reliable lead-free solder joints: micro-fracture properties of Au-Sn based solder. European solid mechanics conference (ESMC) 2018, Bologna, Italy (2018)

Brinckmann, S.; Kirchlechner, C.; Dehm, G.; Matoy, K.: Using simulations to investigate the apparent fracture toughness of microcantilevers. Nanomechanical Testing in Materials Research and Development VI, Dubrovnik, Croatia (2017)