Publikationen von Christoph Kirchlechner

Malyar, N.; Dehm, G.; Kirchlechner, C.: Strain rate dependence of the slip transfer through a penetrable high angle grain boundary in copper. Scripta Materialia 138, S. 88 - 91 (2017)

Toth, F.; Kirchlechner, C.; Fischer, F. D.; Dehm, G.; Rammerstorfer, F. G.: Compressed Bi-crystal micropillars showing a sigmoidal deformation state – A computational study. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 700, S. 168 - 174 (2017)

Choi, W. S.; Sandlöbes, S.; Malyar, N.; Kirchlechner, C.; Korte-Kerzel, S.; Dehm, G.; De Cooman, B. C.; Raabe, D.: Dislocation interaction and twinning-induced plasticity in face-centered cubic Fe–Mn–C micro-pillars. Acta Materialia 132, S. 162 - 173 (2017)

Jörg, T.; Cordill, M. J.; Franz, R.; Kirchlechner, C.; Többens, D. M.; Winkler, J.; Mitterer, C.: Thickness dependence of the electro-mechanical response of sputter deposited Mo thin films on polyimide: Insights from in situ synchrotron diffraction tensile tests. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 697, S. 17 - 23 (2017)

Abboud, A.; Kirchlechner, C.; Kečkéš, J.; Çonka-Nurdan, T.; Send, S.; Micha, J.-S.; Ulrich, O.; Hartmann, R.; Strüderf, L.; Pietsch, U.: Single-shot full strain tensor determination with microbeam X-ray Laue diffraction and a twodimensional energy-dispersive detector. Journal of Applied Crystallography 50 (3), S. 901 - 908 (2017)

Malyar, N.; Micha, J.-S.; Dehm, G.; Kirchlechner, C.: Dislocation-twin boundary interaction in small scale Cu bi-crystals loaded in different crystallographic directions. Acta Materialia 129, S. 91 - 97 (2017)

Malyar, N.; Micha, J.-S.; Dehm, G.; Kirchlechner, C.: Size effect in bi-crystalline micropillars with a penetrable high angle grain boundary. Acta Materialia 129, S. 312 - 320 (2017)

Peter, N. J.; Liebscher, C.; Kirchlechner, C.; Dehm, G.: Beam-induced atomic migration at Ag-containing nanofacets at an asymmetric Cu grain boundary. Journal of Materials Research 32 (5), S. 968 - 982 (2017)

Philippi, B.; Matoy, K.; Zechner, J.; Kirchlechner, C.; Dehm, G.: Microcantilever Fracture Testing of Intermetallic Cu₃Sn in Lead-Free Solder Interconnects. Journal of Electronic Materials 46 (3), S. 1607 - 1611 (2017)

Raghavan, R.; Kirchlechner, C.; Jaya, B. N.; Feuerbacher, M.; Dehm, G.: Mechanical size effects in a single crystalline equiatomic FeCrCoMnNi high entropy alloy. Scripta Materialia 129, S. 52 - 55 (2017)

Marx, V. M.; Cordill, M. J.; Többens, D. M.; Kirchlechner, C.; Dehm, G.: Effect of annealing on the size dependent deformation behavior of thin cobalt films on flexible substrates. Thin Solid Films 624, S. 34 - 40 (2017)

Kirchlechner, C.; Toth, F.; Rammerstorfer, F. G.; Fischer, F. D.; Dehm, G.: Pre- and post-buckling behavior of bi-crystalline micropillars: Origin and consequences. Acta Materialia 124, S. 195 - 203 (2017)

Brinckmann, S.; Kirchlechner, C.; Dehm, G.: Stress intensity factor dependence on anisotropy and geometry during micro-fracture experiments. Scripta Materialia 127, S. 76 - 78 (2017)

Kirchlechner, C.; Djaziri, S.; Li, Y.; Herbig, M.; Grabowski, B.; Nematollahi, G. A.; Goto, S.; Kirchheim, R.; Neugebauer, J.; Raabe, D. et al.; Dehm, G.: Konkurrenzlose Festigkeit durch extremes Umformen von Stahl. Stahl und Eisen 137 (8), S. 58 - 58 (2017)

Raghavan, R.; Harzer, T. P.; Djaziri, S.; Hieke, S. W.; Kirchlechner, C.; Dehm, G.: Maintaining strength in supersaturated copper–chromium thin films annealed at 0.5 of the melting temperature of Cu. Journal of Materials Science 52 (2), S. 913 - 920 (2017)

Marx, V. M.; Kirchlechner, C.; Breitbach, B.; Cordill, M. J.; Többens, D. M.; Waitz, T.; Dehm, G.: Strain-induced phase transformation of a thin Co film on flexible substrates. Acta Materialia 121, S. 227 - 233 (2016)

Hahn, R.; Bartosik, M.; Soler, R.; Kirchlechner, C.; Dehm, G.; Mayrhofer, P. H.: Superlattice effect for enhanced fracture toughness of hard coatings. Scripta Materialia 124, S. 67 - 70 (2016)

Davydok, A.; Jaya, B. N.; Robach, O.; Ulrich, O.; Micha, J.-S.; Kirchlechner, C.: Analysis of the full stress tensor in a micropillar: Ability of and difficulties arising during synchrotron based μLaue diffraction. Materials and Design 108, S. 68 - 75 (2016)

Philippi, B.; Matoy, K.; Zechner, J.; Kirchlechner, C.; Dehm, G.: Fracture toughness of intermetallic Cu₆Sn₅ in lead-free solder microelectronics. Scripta Materialia 123, S. 38 - 41 (2016)

Djaziri, S.; Li, Y.; Nematollahi, G. A.; Grabowski, B.; Goto, S.; Kirchlechner, C.; Kostka, A.; Doyle, S.; Neugebauer, J.; Raabe, D. et al.; Dehm, G.: Deformation-Induced Martensite: A New Paradigm for Exceptional Steels. Advanced Materials 28 (35), S. 7753 - 7757 (2016)