Publikationen von Andreas Schießl

Philippi, B.; Schießl, A.; Schingale, A.; Dehm, G.: Micromechanical investigation of lead-free solder joints in microelectronics. TMS 2014, San Diego, CA, USA (2014)

Philippi, B.; Schießl, A.; Schingale, A.; Dehm, G.: Micromechanical testing of lead-free solder joints in microelectronics. Arbeitskreistreffen Rasterkraftmikroskopie und nanomechanische Methoden, MPI für Eisenforschung GmbH, Düsseldorf, Deutschland (2014)

Philippi, B.; Schießl, A.; Schingale, A.; Dehm, G.: Micromechanical investigation of solder joints in automotive microelectronics. Euromat 2013, Sevilla, Spanien (2013)

Philippi, B.; Kirchlechner, C.; Schießl, A.; Schingale, A.; Dehm, G.: Improving lead-free solders by resolving mechanical properties at the microstructure length scale. Thin Film & Small Scale Mechanical Behavior 2014, Gordon Research Conference, Waltham, MA, USA (2014)

Philippi, B.; Schießl, A.; Schingale, A.; Dehm, G.: Micromechanical investigation of solder joints for automotive microelectronics. Nano- and Micromechanical Testing in Materials Research and Development IV, Olhão Algarve, Portugal (2013)

Philippi, B.; Schießl, A.; Schingale, A.; Dehm, G.: Micromechanical investigation of lead-free solder joints in microelectronics. Small Scale Plasticity School, Cargèse, Korsika, France (2013)