Publikationen von Gerhard Dehm

Smolka, M.; Motz, C.; Detzel, T.; Robl, W.; Grießer, T.; Wimmer, A.; Dehm, G.: Novel temperature dependent tensile test of freestanding copper thin film structures. Review of Scientific Instruments 83 (6), 064702 (2012)

Kiener, D.; Zhang, Z.; Šturm, S.; Cazottes, S.; Imrich, P. J.; Kirchlechner, C.; Dehm, G.: Advanced nanomechanics in the TEM: Effects of thermal annealing on FIB prepared Cu samples. Philosophical Magazine 92 (25-27), 185, S. 3269 - 3289 (2012)

Kiener, D.; Zhang, Z.; Šturm, S.; Cazottes, S.; Imrich, P. J.; Kirchlechner, C.; Dehm, G.: Advanced nanomechanics in the TEM: effects of thermal annealing on FIB prepared Cu samples. Philosophical Magazine 92 (25-27), S. 3269 - 3289 (2012)

Sonnweber-Ribic, P.; Gruber, P. A.; Dehm, G.; Strunk, H. P.; Arzt, E.: Kinetics and driving forces of abnormal grain growth in thin Cu films. Acta Materialia 60 (5), S. 2397 - 2406 (2012)

Cha, L.; Schmoelzer, T.; Zhang, Z.; Mayer, S.; Clemens, H. J.; Staron, P.; Dehm, G.: In Situ Study of Gamma-TiAl Lamellae Formation in Supersaturated alpha(2)-Ti₃Al Grains. Advanced Engineering Materials 14 (5), S. 299 - 303 (2012)

Moser, G.; Felber, H.; Rashkova, B.; Imrich, P. J.; Kirchlechner, C.; Grosinger, W.; Motz, C.; Dehm, G.; Kiener, D.: Sample Preparation by Metallography and Focused Ion Beam for Nanomechanical Testing. Praktische Metallographie-Practical Metallography 49 (6), S. 343 - 355 (2012)

Heinz, W.; Dehm, G.: Grain resolved orientation changes and texture evolution in a thermally strained Al film on Si substrate. Surface and Coatings Technology 206 (7), S. 1850 - 1854 (2011)

Taylor, A. A.; Edlmayr, V.; Cordill, M. J.; Dehm, G.: The effect of temperature and strain rate on the periodic cracking of amorphous Al_xO_y films on Cu. Surface and Coatings Technology 206 (7), S. 1855 - 1859 (2011)

Taylor, A. A.; Edlmayr, V.; Cordill, M. J.; Dehm, G.: The effect of film thickness variations in periodic cracking: Analysis and experiments. Surface and Coatings Technology 206 (7), S. 1830 - 1836 (2011)

Dehm, G.; Pippan, R.: 40 Jahre Erich-Schmid-Institut für Materialwissenschaft der ÖAW. Österreich Journal 102, S. 1 - 1 (2011)

Pippan, R.; Kolednik, O.; Rashkova, B.; Kirchlechner, C.; Kiener, D.; Dehm, G.: Tiefe Einblicke in die Strukturen. Kleine Zeitung Uni 30, S. 2 - 2 (2011)

Oh, S. H.; Rentenberger, C.; Im, J.; Motz, C.; Kiener, D.; Karnthaler, H.-P.; Dehm, G.; Dehm, G.: Dislocation plasticity of Al film on polyimide investigated by cross-sectional in situ transmission electron microscopy straining. Scripta Materialia 65 (5), S. 456 - 459 (2011)

Kirchlechner, C.; Kečkéš, J.; Motz, C.; Grosinger, W.; Kapp, M. W.; Micha, J.-S.; Ulrich, O.; Dehm, G.: Impact of instrumental constraints and imperfections on the dislocation structure in micron-sized Cu compression pillars. Acta Materialia 59 (14), S. 5618 - 5626 (2011)

Cordill, M. J.; Schmidegg, K.; Dehm, G.: Interface failure and adhesion measured by focused ion beam cutting of metal-polymer interfaces. Philosophical Magazine Letters 91 (8), S. 530 - 536 (2011)

Kirchlechner, C.; Kečkéš, J.; Micha, J.-S.; Dehm, G.: In Situ µLaue: Instrumental Setup for the Deformation of Micron Sized Samples. Advanced Engineering Materials 13 (8), S. 837 - 844 (2011)

Taylor, A. A.; Cordill, M. J.; Moser, G.; Dehm, G.: A Mechanical Method for Preparing TEM Samples from Brittle Films on Compliant Substrates. Practical Metallography - Praktische Metallographie 48 (8), S. 408 - 413 (2011)

Cordill, M. J.; Taylor, A. A.; Schalko, J.; Dehm, G.: Microstructure and adhesion of as-deposited and annealed Cu/Ti films on polyimide. International Journal of Materials Research 102 (6), S. 729 - 734 (2011)

Kiener, D.; Guruprasad, P. J.; Keralavarma, S. M.; Dehm, G.; Benzerga, A. A.: Work hardening in micropillar compression: In situ experiments and modeling. Acta Materialia 59 (10), S. 3825 - 3840 (2011)

Rester, M.; Fischer, F. D.; Kirchlechner, C.; Schmoelzer, T.; Clemens, H. J.; Dehm, G.: Deformation mechanisms in micron-sized PST TiAl compression samples: Experiment and model. Acta Materialia 59 (9), S. 3410 - 3421 (2011)

Hou, J.; Zhang, Z.; Preis, W.; Sitte, W.; Dehm, G.: Electrical properties and structure of grain boundaries in n-conducting BaTiO₃ ceramics. Journal of the European Ceramic Society 31 (5), S. 763 - 771 (2011)