Publikationen von Gerhard Dehm

Fischer, F. D.; Cha, L.; Dehm, G.; Clemens, H. J.: Can local hot spots induce α₂/γ lamellae during incomplete massive transformation of γ-TiAl alloys? Intermetallics 18 (5), S. 972 - 976 (2010)

Huang, R.; Robl, W.; Ceric, H.; Detzel, T.; Dehm, G.: Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing. IEEE Transactions 10 (1), S. 47 - 54 (2010)

Fischer , F. D.; Waitz, T.; Scheu, C.; Cha, L.; Dehm, G.: Study of nanometer-scaled lamellar microstructure in a Ti–45Al–7.5Nb alloy – Experiments and modeling. Intermetallics 18 (4), S. 509 - 517 (2010)

Dehm, G.; Wörgötter, H. P.; Cazottes, S.; Purswani, J. M.; Gall, D.; Mitterer, C.; Kiener, D.: Can micro-compression testing provide stress–strain data for thin films? A comparative study using Cu, VN, TiN and W coatings. Thin Solid Films 518 (5), S. 1517 - 1521 (2009)

Matoy, K.; Detzel, T.; Müller , M.; Motz, C.; Dehm, G.: Interface fracture properties of thin films studied by using the micro-cantilever deflection technique. Surface and Coatings Technology 204 (6-7), S. 878 - 881 (2009)

Matoy, K.; Schönherr, H.; Detzel, T.; Schöberl, T.; Pippan, R.; Motz, C.; Dehm, G.: A comparative micro-cantilever study of the mechanical behavior of silicon based passivation films. Thin Solid Films 518 (1), S. 247 - 256 (2009)

Dehm, G.: Miniaturized single-crystalline fcc metals deformed in tension: New insights in size-dependent plasticity. Progress in Materials Science 54 (6), S. 664 - 688 (2009)

Yang, B.; Motz, C.; Grosinger, W.; Dehm, G.: Stress-controlled fatigue behaviour of micro-sized polycrystalline copper wires. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 515 (1-2), S. 71 - 78 (2009)

Kiener, D.; Motz, C.; Dehm, G.: Micro-compression testing: A critical discussion of experimental constraints. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 505 (1-2), S. 79 - 87 (2009)

Guidoni, G. M.; He, L.; Schöberl, T.; Jäger, I.; Dehm, G.; Swain, M. V.: Influence of the indenter tip geometry and environment on the indentation modulus of enamel. Journal of Materials Research 24 (3), S. 616 - 625 (2009)

Kiener, D.; Grosinger, W.; Dehm, G.: On the importance of sample compliance in uniaxial mircotesting. Scripta Materialia 60 (3), S. 148 - 151 (2009)

Oh, S. H.; Legros, M.; Kiener, D.; Dehm, G.: In situ observation of dislocation nucleation and escape in a submicrometre aluminium single crystal. Nature Materials 8 (2), S. 95 - 100 (2009)

Kiener, D.; Motz, C.; Dehm, G.; Pippan, R.: Overview on established and novel FIB based miniaturized mechanical testing using in-situ SEM. International Journal of Materials Research 100 (8), S. 1074 - 1087 (2009)

Reinhold, M.; Kiener, D.; Knowlton, W. B.; Dehm, G.; Müllner, P.: Deformation twinning in Ni–Mn–Ga micropillars with 10M martensite. Journal of Applied Physics 106 (5), 053906 (2009)

Lazar, P.; Rashkova, B.; Redinger, J.; Podloucky, R.; Mitterer, C.; Scheu, C.; Dehm, G.: Interface structure of epitaxial (111) VN films on (111) MgO substrates. Thin Solid Films 517 (3), S. 1177 - 1181 (2008)

Rashkova, B.; Prantl, W.; Görgl, R.; Kečkéš, J.; Cohen, S. S.; Bamberger, M. S.; Dehm, G.: Precipitation processes in a Mg–Zn–Sn alloy studied by TEM and SAXS. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 494 (1-2), S. 158 - 165 (2008)

Kapp, M.; Martinschitz, K. J.; Kečkéš, J.; Lackner, J.M.; Zizak, I.; Dehm, G.: Thermal stresses and microstructure of tungsten films on copper. BHM Berg- und Hüttenmännische Monatshefte 153 (7), S. 273 - 277 (2008)

Wörgötter, H.-P.; Kiener, D.; Purswani, J. M.; Gall, D.; Dehm, G.: Testing thin films by microcompression: Benefits and limits. BHM Berg- und Hüttenmännische Monatshefte 153 (7), S. 257 - 262 (2008)

Cha, L.; Scheu, C.; Clemens, H.; Chladil, H. F.; Dehm, G.; Gerling, R. W.; Bartels, A.: Nanometer-scaled lamellar microstructures in Ti–45Al–7.5Nb–(0; 0.5)C alloys and their influence on hardness. Intermetallics 16 (7), S. 868 - 875 (2008)

Yang, B.; Motz, C.; Grosinger, W.; Kammrath, W.; Dehm, G.: Tensile behaviour of micro-sized copper wires studied by a novel fibre tensile module. International Journal of Materials Research 99 (7), S. 716 - 724 (2008)