Publikationen von Johannes Zechner

Du, C.; Soler, R.; Völker, B.; Matoy, K.; Zechner, J.; Langer, G.; Reisinger, M.; Todt, J.; Kirchlechner, C.; Dehm, G.: Au–Sn solders applied in transient liquid phase bonding: Microstructure and mechanical behavior. Materialia 8, 100503 (2019)

Philippi, B.; Matoy, K.; Zechner, J.; Kirchlechner, C.; Dehm, G.: Microcantilever Fracture Testing of Intermetallic Cu₃Sn in Lead-Free Solder Interconnects. Journal of Electronic Materials 46 (3), S. 1607 - 1611 (2017)

Philippi, B.; Matoy, K.; Zechner, J.; Kirchlechner, C.; Dehm, G.: Fracture toughness of intermetallic Cu₆Sn₅ in lead-free solder microelectronics. Scripta Materialia 123, S. 38 - 41 (2016)

Wheeler, J. M.; Raghavan, R.; Raghavan, R.; Chawla, V.; Zechner, J.; Utke, I.; Michler, J. K.: Failure mechanisms in metal-metal nanolaminates at elevated temperatures: Microcompression of Cu–W multilayers. Scripta Materialia 98, S. 28 - 31 (2015)

Du, C.; Matoy, K.; Zechner, J.; Reisinger, M.; Robl, W.; Hartl, R.; Kirchlechner, C.; Dehm, G.: Ni–P: Microstructure and micro-compression. Nanomechanical Testing in Materials Research and Development VII , Malaga, Spain (2019)

Du, C.; Soler, R.; Matoy, K.; Zechner, J.; Langer, G.; Kirchlechner, C.; Dehm, G.: Pathways for reliable lead-free solder joints: micro-fracture properties of Au-Sn based solder. European solid mechanics conference (ESMC) 2018, Bologna, Italy (2018)