Publikationen von Gerhard Dehm

Lazar, P.; Rashkova, B.; Redinger, J.; Podloucky, R.; Mitterer, C.; Scheu, C.; Dehm, G.: Interface structure of epitaxial (111) VN films on (111) MgO substrates. Thin Solid Films 517 (3), S. 1177 - 1181 (2008)

Rashkova, B.; Prantl, W.; Görgl, R.; Kečkéš, J.; Cohen, S. S.; Bamberger, M. S.; Dehm, G.: Precipitation processes in a Mg–Zn–Sn alloy studied by TEM and SAXS. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 494 (1-2), S. 158 - 165 (2008)

Kapp, M.; Martinschitz, K. J.; Kečkéš, J.; Lackner, J.M.; Zizak, I.; Dehm, G.: Thermal stresses and microstructure of tungsten films on copper. BHM Berg- und Hüttenmännische Monatshefte 153 (7), S. 273 - 277 (2008)

Wörgötter, H.-P.; Kiener, D.; Purswani, J. M.; Gall, D.; Dehm, G.: Testing thin films by microcompression: Benefits and limits. BHM Berg- und Hüttenmännische Monatshefte 153 (7), S. 257 - 262 (2008)

Cha, L.; Scheu, C.; Clemens, H.; Chladil, H. F.; Dehm, G.; Gerling, R. W.; Bartels, A.: Nanometer-scaled lamellar microstructures in Ti–45Al–7.5Nb–(0; 0.5)C alloys and their influence on hardness. Intermetallics 16 (7), S. 868 - 875 (2008)

Yang, B.; Motz, C.; Grosinger, W.; Kammrath, W.; Dehm, G.: Tensile behaviour of micro-sized copper wires studied by a novel fibre tensile module. International Journal of Materials Research 99 (7), S. 716 - 724 (2008)

Kiener, D.; Motz, C.; Dehm, G.: Dislocation-induced crystal rotations in micro-compressed single crystal copper columns. Journal of Materials Science 43 (7), S. 2503 - 2506 (2008)

Kiener, D.; Grosinger, W.; Dehm, G.; Pippan, R.: A further step towards an understanding of size-dependent crystal plasticity: In situ tenison experiments of miniaturized single-crystal copper samples. Acta Materialia 56 (3), S. 580 - 592 (2008)

Robertson, I. M.; Ferreira, P. J.; Dehm, G.; Hull, R. V.; Stach, E. A.: Visualizing the behavior of dislocations - Seeing is believing. MRS Bulletin 33 (2), S. 122 - 131 (2008)

Bamberger, M. S.; Dehm, G.: Trends in the development of new Mg alloys. Annual Review of Materials Research 38, S. 505 - 533 (2008)

Lazar, P.; Redinger, J.; Strobl, J.; Podloucky, R.; Rashkova, B.; Dehm, G.; Kothleitner, G.; Šturm, S.; Kutschej, K.; Mitterer, C. et al.; Scheu, C.: N–K electron energy-loss near-edge structures for TiN/VN layers: an ab initio and experimental study. Analytical and Bioanalytical Chemistry 390 (6), S. 1447 - 1453 (2008)

Maaß, R.; Van Petegem, S. V.; Grolimund, D.; Van Swygenhoven, H.; Kiener, D.; Dehm, G.: Crystal rotation in Cu single crystal micropillars: In situ Laue and electron backscatter diffraction. Applied Physics Letters 92 (7), 071905 (2008)

Kutschej, K.; Rashkova, B.; Shen, J.; Edwards, D.; Mitterer, C.; Dehm, G.: Experimental studies on epitaxially grown TiN and VN films. Thin Solid Films 516 (2-4), S. 369 - 373 (2007)

Rashkova, B.; Lazar, P.; Redinger, J.; Podloucky, R.; Kothleitner, G.; Šturm, S.; Kutschej, K.; Mitterer, C.; Scheu, C.; Dehm, G.: Combined ab-initio and N–K, Ti-L_2,3, V-L_2,3 electron energy-loss near edge structure studies for TiN and VN films. Zeitschrift für Metallkunde/Materials Research and Advanced Techniques 98 (11), S. 1060 - 1065 (2007)

Dehm, G.; Oh, S. H.; Gruber, P. A.; Legros, M.; Fischer, F. D.: Strain compensation by twinning in Au thin films: Experiment and model. Acta Materialia 55 (19), S. 6659 - 6665 (2007)

Kiener, D.; Rester, M.; Scheriau, S.; Yang, B.; Pippan, R.; Dehm, G.: Influence of external and internal length scale on the flow stress of copper. International Journal of Materials Research 98 (11), S. 1047 - 1053 (2007)

Inkson, B. J.; Dehm, G.; Peng, Y.: Dynamical growth of Cu-Pt nanowires with a nanonecklace morphology. Nanotechnology 18 (41), 415601, S. 1 - 5 (2007)

Oh, S. H.; Legros, M.; Kiener, D.; Gruber, P. A.; Dehm, G.: In situ TEM straining of single crystal Au films on polyimide: Change of deformation mechanisms at the nanoscale. Acta Materialia 55 (16), S. 5558 - 5571 (2007)

Kiener, D.; Motz, C.; Rester, M.; Jenko, M.; Dehm, G.: FIB damage of Cu and possible consequences for miniaturized mechanical tests. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 459 (1-2), S. 262 - 272 (2007)

Eiper, E.; Kečkéš, J.; Martinschitz, K. J.; Zizak, I.; Cabié, M.; Dehm, G.: Size-independent stresses in Al thin films thermally strained down to -100°C. Acta Materialia 55 (6), S. 1941 - 1946 (2007)