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Zeitschriftenartikel (265)

  1. 101.
    Zeitschriftenartikel
    Wimmer, A. C.; Heinz, W.; Leitner, A.; Detzel, T.; Robl, W.; Kirchlechner, C.; Dehm, G.: Micro-tension study of miniaturized Cu lines at variable temperatures. Acta Materialia 92, S. 243 - 254 (2015)
  2. 102.
    Zeitschriftenartikel
    Jeon, J. B.; Dehm, G.: Formation of dislocation networks in a coherent Cu Σ3 (1 1 1) twin boundary. Scripta Materialia 102, S. 71 - 74 (2015)
  3. 103.
    Zeitschriftenartikel
    Völker, B.; Heinz, W.; Matoy, K.; Roth, R.; Batke, J. M.; Schöberl, T.; Cordill, M. J.; Dehm, G.: Mechanical and chemical investigation of the interface between tungsten-based metallizations and annealed borophosphosilicate glass. Thin Solid Films 583, S. 170 - 176 (2015)
  4. 104.
    Zeitschriftenartikel
    Völker, B.; Heinz, W.; Roth, R.; Batke, J. M.; Cordill, M. J.; Dehm, G.: Downscaling metal-dielectric interface fracture experiments to sub-micron dimensions: A feasibility study using TEM. Surface and Coatings Technology 270, S. 1 - 7 (2015)
  5. 105.
    Zeitschriftenartikel
    Marx, V. M.; Toth, F.; Wiesinger, A.; Berger, J.; Kirchlechner, C.; Cordill, M. J.; Fischer, F. D.; Rammerstorfer, F. G.; Dehm, G.: The influence of a brittle Cr interlayer on the deformation behavior of thin Cu films on flexible substrates: Experiment and model. Acta Materialia 89, S. 278 - 289 (2015)
  6. 106.
    Zeitschriftenartikel
    Imrich, P. J.; Kirchlechner, C.; Kiener, D.; Dehm, G.: Internal and external stresses: in situ TEM compression of Cu bicrystals containing a twin boundary. Scripta Materialia 100, S. 94 - 97 (2015)
  7. 107.
    Zeitschriftenartikel
    Kapp, M. W.; Kapp, M. W.; Kirchlechner, C.; Pippan, R.; Dehm, G.: Importance of dislocations pile-ups on the mechanical properties and the Bauschinger effect in micro cantilevers. Journal of Materials Research 30 (6), S. 791 - 797 (2015)
  8. 108.
    Zeitschriftenartikel
    Jaya, B. N.; Kirchlechner, C.; Dehm, G.: Can micro-scale fracture tests provide reliable fracture toughness values? A case study in silicon. Journal of Materials Research 30 (5), S. 686 - 698 (2015)
  9. 109.
    Zeitschriftenartikel
    Harzer, T. P.; Djaziri, S.; Raghavan, R.; Dehm, G.: Nanostructure and mechanical behavior of metastable Cu–Cr thin films grown by molecular beam epitaxy. Acta Materialia 83, S. 318 - 332 (2015)
  10. 110.
    Zeitschriftenartikel
    Heinz, W.; Robl, W.; Dehm, G.: Influence of initial microstructure on thermomechanical fatigue behavior of Cu films on substrates. Microelectronic Engineering 137, S. 5 - 10 (2015)
  11. 111.
    Zeitschriftenartikel
    Völker, B.; Heinz, W.; Matoy, K.; Roth, R.; Batke, J. M.; Schöberl, T.; Scheu, C.; Dehm, G.: Interface fracture and chemistry of a tungsten-based metallization on borophosphosilicate glass. Philosophical Magazine 95 (16-18), S. 1967 - 1981 (2015)
  12. 112.
    Zeitschriftenartikel
    Völker, B.; Venkatesan, S.; Heinz, W.; Matoy, K.; Roth, R.; Batke, J. M.; Cordill, M. J.; Dehm, G.: Following crack path selection in multi-film structures with weak and strong interfaces by in-situ 4-point-bending. Journal of Materials Research 30 (8), S. 1090 - 1097 (2015)
  13. 113.
    Zeitschriftenartikel
    Wimmer, A. C.; Heinz, W.; Detzel, T.; Robl, W.; Nellessen, M.; Kirchlechner, C.; Dehm, G.: Cyclic bending experiments on freestanding Cu micron lines observed by EBSD. Acta Materialia 83, S. 460 - 469 (2015)
  14. 114.
    Zeitschriftenartikel
    Zhang, Z.; Dehm, G.: Study on the Atomic and Electronic Structure in CrN (VN, TiN) Films using Cs-Corrected TEM. Microscopy and Microanalysis 21 (3), S. 2079 - 2080 (2015)
  15. 115.
    Zeitschriftenartikel
    Brinckmann, S.; Völker, B.; Dehm, G.: Crack deflection in multi-layered four-point bending samples. International Journal of Fracture 190 (1-2), S. 167 - 176 (2014)
  16. 116.
    Zeitschriftenartikel
    Wimmer, A. C.; Smółka, M. N.; Heinz, W.; Detzel, T.; Robl, W.; Motz, C.; Eyert, V.; Wimmer, E.; Jahnel, F.; Treichler, R. et al.; Dehm, G.: Temperature dependent transition of intragranular plastic to intergranular brittle failure in electrodeposited Cu micro-tensile samples. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 618, S. 398 - 405 (2014)
  17. 117.
    Zeitschriftenartikel
    Rashkova, B.; Faller, M.; Pippan, R.; Dehm, G.: Growth mechanism of Al2Cu precipitates during in situ TEM heating of a HPT deformed Al–3wt.%Cu alloy. Journal of Alloys and Compounds 600, S. 43 - 50 (2014)
  18. 118.
    Zeitschriftenartikel
    Imrich, P. J.; Kirchlechner, C.; Motz, C.; Dehm, G.: Differences in deformation behavior of bicrystalline Cu micropillars containing a twin boundary or a large-angle grain boundary. Acta Materialia 73, S. 240 - 250 (2014)
  19. 119.
    Zeitschriftenartikel
    Wimmer, A.; Leitner, A.; Detzel, T.; Robl, W.; Heinz, W.; Pippan, R.; Dehm, G.: Damage evolution during cyclic tension-tension loading of micron-sized Cu lines. Acta Materialia 67, S. 297 - 307 (2014)
  20. 120.
    Zeitschriftenartikel
    Li, J.; Wimmer, A.; Dehm, G.; Schumacher, P.: Intermetallic phase selection during homogenisation for AA6082 alloy. Philosophical Magazine 94 (8), S. 830 - 846 (2014)
 
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