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Zeitschriftenartikel (1)

1.
Zeitschriftenartikel
Huang, R.; Robl, W.; Ceric, H.; Detzel, T.; Dehm, G.: Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing. IEEE Transactions 10 (1), S. 47 - 54 (2010)

Konferenzbeitrag (1)

2.
Konferenzbeitrag
Huang, R.; Robl, W.; Dehm, G.; Ceric, H.; Detzel, T.: Disparate tendency of stress evolution of thin and thick electroplated Cu films at room temperature. In: Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, 5532222, S. 1 - 6. International Symposium on the Physical and Failure Analysis of Integrated Circuits IPFA 2010, Singapore, Singapore, 05. Juli 2010 - 09. Juli 2010. IEEE (2010)
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