Publikationen von Tobias Brink

Choi, Y.; Brink, T.: Faceting transition in aluminum as a grain boundary phase transition. Physical Review Materials 9 (8), 083607 (2025)

Bellón Lara, B.; Bhaskar, L.; Brink, T.; Aymerich Armengol, R.; Sonawane, D.; Chatain, D.; Dehm, G.; Ramachandramoorthy, R.: High strain rate compressive deformation behavior of nickel microparticles. Materials Today 87, S. 90 - 102 (2025)

Devulapalli, V.; Chen, E.; Brink, T.; Frolov, T.; Liebscher, C.: Topological grain boundary segregation transitions. Science 386 (6720), S. 420 - 424 (2024)

Sevlikar, S. V.; Muralikrishna, G. M.; Gaertner, D.; Starikov, S.; Brink, T.; Scheiber, D.; Smirnova, D.; Irmer, D.; Tas, B.; Esin, V. A. et al.; Razumovskiy, V. I.; Liebscher, C.; Wilde, G.; Divinski, S. V.: Grain boundary diffusion and segregation of Cr in Ni Σ11(1̄13)[110] bicrystals: Decoding the role of grain boundary defects. Acta Materialia 278, 120229 (2024)

Ahmad, S.; Brink, T.; Liebscher, C.; Dehm, G.: Influence of variation in grain boundary parameters on the evolution of atomic structure and properties of [111] tilt boundaries in aluminum. Acta Materialia 268, 119732 (2024)

Brink, T.; Langenohl, L.; Pemma, S.; Liebscher, C.; Dehm, G.: Stable nanofacets in [111] tilt grain boundaries of face-centered cubic metals. Physical Review Materials 8 (6), 063606 (2024)

Pemma, S.; Janisch, R.; Dehm, G.; Brink, T.: Effect of the atomic structure of complexions on the active disconnection mode during shear-coupled grain boundary motion. Physical Review Materials 8 (6), 063602 (2024)

Garcia-Suarez, J.; Brink, T.; Molinari, J.-F.: Breakdown of Reye’s theory in nanoscale wear. Journal of the Mechanics and Physics of Solids 173, 105236 (2023)

Langenohl, L.; Brink, T.; Richter, G.; Dehm, G.; Liebscher, C.: Atomic-resolution observations of silver segregation in a [111] tilt grain boundary in copper. Physical Review B 107 (13), 134112 (2023)

Brink, T.; Langenohl, L.; Bishara, H.; Dehm, G.: Universality of grain boundary phases in fcc metals: Case study on high-angle [111] symmetric tilt grain boundaries. Physical Review B 107 (5), 054103 (2023)

Ahmad, S.; Brink, T.; Liebscher, C.; Dehm, G.: Microstates and defects of incoherent Σ3 [111] twin boundaries in aluminum. Acta Materialia 243, 118499 (2023)

Langenohl, L.; Brink, T.; Freitas, R.; Frolov, T.; Dehm, G.; Liebscher, C.: Dual phase patterning during a congruent grain boundary phase transition in elemental copper. Nature Communications 13 (1), 3331 (2022)

Bishara, H.; Lee, S.; Brink, T.; Ghidelli, M.; Dehm, G.: Understanding Grain Boundary Electrical Resistivity in Cu: The Effect of Boundary Structure. ACS Nano 15 (10), S. 16607 - 16615 (2021)

Costagliola, G.; Brink, T.; Richard, J.; Leppin, C.; Despois, A.; Molinari, J.-F.: A Simple Mechanistic Model for Friction of Rough Partially Lubricated Surfaces. Tribology Letters 69 (3), 93 (2021)

Brink, T.; Pemma, S.; Choi, Y.; Dehm, G.: From the microscopic to the macroscopic grain boundary: The role of line defects. 2026 MRS Spring Meeting & Exhibit, Honolulu, HI, USA (2026)

Brink, T.; Pemma, S.; Langenohl, L.; Saood, S.; Choi, Y.; Janisch, R.; Liebscher, C.; Dehm, G.: Grain boundary thermodynamics away from idealized boundaries: How line defects affect stability. DPG-Frühjahrstagung 2026, Dresden, Germany (2026)

Brink, T.; Kim, D.; Dehm, G.: Atomistic computer simulations of the influence of grain boundary phases on segregation. DPG-Frühjahrstagung 2025, Regensburg, Germany (2025)

Brink, T.; Langenohl, L.; Pemma, S.; Liebscher, C.; Dehm, G.: Grain boundaries in fcc metals with energetically stable nanofacets. The 11th International Conference on Multiscale Materials Modeling, Prague, Czech Republic (2024)

Bellón Lara, B.; Bhaskar, L.; Sonawane, S.; Brink, T.; Aymerich Armengol, R.; Chatain, D.; Dehm, G.; Ramachandramoorthy, R.: Compression of dewetted Nickel microparticles at ultra-high strain rates. 19th European Mechanics of Materials Conference, Madrid, Spain (2024)

Bhat, M. K.; Brink, T.; Ding, H.; Jung, C.; Best, J. P.; Dehm, G.: Influence of the Structure and Chemistry of Σ5 Grain Boundaries on Microscale Strengthening in Cu Bicrystals. TMS Annual Meeting and Exhibition 2024, Orlando, FL, USA (2024)