Publikationen von G. Dehm
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  Zeitschriftenartikel (376)
241.
        
            Zeitschriftenartikel
            
           Investigation of reversible plasticity in a micron-sized, single crystalline copper bending beam by X-ray μLaue diffraction. Philosophical Magazine 92 (25-27), S. 3231 - 3242 (2012)
          242.
        
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           On the limits of the interfacial yield model for fragmentation testing of brittle films on polymer substrates. Philosophical Magazine 92 (25-27), S. 3363 - 3380 (2012)
          243.
        
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           Yield stress influenced by the ratio of wire diameter to grain size – a competition between the effects of specimen microstructure and dimension in micro-sized polycrystalline copper wires. Philosophical Magazine Letters; Nano-mechanical testing in materials research and development III 92 (25-27), S. 3243 - 3256 (2012)
          244.
        
            Zeitschriftenartikel
            
           Novel temperature dependent tensile test of freestanding copper thin film structures. Review of Scientific Instruments 83 (6), 064702 (2012)
          245.
        
            Zeitschriftenartikel
            
           Advanced nanomechanics in the TEM: Effects of thermal annealing on FIB prepared Cu samples. Philosophical Magazine 92 (25-27), 185, S. 3269 - 3289 (2012)
          246.
        
            Zeitschriftenartikel
            
           Advanced nanomechanics in the TEM: effects of thermal annealing on FIB prepared Cu samples. Philosophical Magazine 92 (25-27), S. 3269 - 3289 (2012)
          247.
        
            Zeitschriftenartikel
            
           Kinetics and driving forces of abnormal grain growth in thin Cu films. Acta Materialia 60 (5), S. 2397 - 2406 (2012)
          248.
        
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           In Situ Study of Gamma-TiAl Lamellae Formation in Supersaturated alpha(2)-Ti3Al Grains. Advanced Engineering Materials 14 (5), S. 299 - 303 (2012)
          249.
        
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           Sample Preparation by Metallography and Focused Ion Beam for Nanomechanical Testing. Praktische Metallographie-Practical Metallography 49 (6), S. 343 - 355 (2012)
          250.
        
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           Grain resolved orientation changes and texture evolution in a thermally strained Al film on Si substrate. Surface and Coatings Technology 206 (7), S. 1850 - 1854 (2011)
          251.
        
            Zeitschriftenartikel
            
           The effect of temperature and strain rate on the periodic cracking of amorphous AlxOy films on Cu. Surface and Coatings Technology 206 (7), S. 1855 - 1859 (2011)
          252.
        
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           The effect of film thickness variations in periodic cracking: Analysis and experiments. Surface and Coatings Technology 206 (7), S. 1830 - 1836 (2011)
          253.
        
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           40 Jahre Erich-Schmid-Institut für Materialwissenschaft der ÖAW. Österreich Journal 102, S. 1 - 1 (2011)
          254.
        
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           Tiefe Einblicke in die Strukturen. Kleine Zeitung Uni 30, S. 2 - 2 (2011)
          255.
        
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           Dislocation plasticity of Al film on polyimide investigated by cross-sectional in situ transmission electron microscopy straining. Scripta Materialia 65 (5), S. 456 - 459 (2011)
          256.
        
            Zeitschriftenartikel
            
           Impact of instrumental constraints and imperfections on the dislocation structure in micron-sized Cu compression pillars. Acta Materialia 59 (14), S. 5618 - 5626 (2011)
          257.
        
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           Interface failure and adhesion measured by focused ion beam cutting of metal-polymer interfaces. Philosophical Magazine Letters 91 (8), S. 530 - 536 (2011)
          258.
        
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           In Situ µLaue: Instrumental Setup for the Deformation of Micron Sized Samples. Advanced Engineering Materials 13 (8), S. 837 - 844 (2011)
          259.
        
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           A Mechanical Method for Preparing TEM Samples from Brittle Films on Compliant Substrates. Practical Metallography - Praktische Metallographie 48 (8), S. 408 - 413 (2011)
          260.
        
            Zeitschriftenartikel
            
           Microstructure and adhesion of as-deposited and annealed Cu/Ti films on polyimide. International Journal of Materials Research 102 (6), S. 729 - 734 (2011)