Publikationen von Gerhard Dehm

Brinckmann, S.; Fink, C.; Dehm, G.: Nanotribology in austenite: Normal force dependence. WEAR 338–339, S. 430 - 435 (2015)

Imrich, P. J.; Kirchlechner, C.; Dehm, G.: Influence of inclined twin boundaries on the deformation behavior of Cu micropillars. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 642, S. 65 - 70 (2015)

Imrich, P. J.; Kirchlechner, C.; Kiener, D.; Dehm, G.: In situ TEM microcompression of single and bicrystalline samples: insights and limitations. JOM-Journal of the Minerals Metals & Materials Society 67 (8), S. 1704 - 1712 (2015)

Raghavan, R.; Harzer, T. P.; Chawla, V.; Djaziri, S.; Philippi, B.; Wehrs, J.; Wheeler, J. M.; Michler, J.; Dehm, G.: Comparing small scale plasticity of copper-chromium nanolayered and alloyed thin films at elevated temperatures. Acta Materialia 93, 12073, S. 175 - 186 (2015)

Marx, V. M.; Kirchlechner, C.; Zizak, I.; Cordill, M. J.; Dehm, G.: Adhesion measurement of a buried Cr interlayer on polyimide. Philosophical Magazine 95 (16-18), S. 1982 - 1991 (2015)

Zhang, Z.; Long, Y.; Cazottes, S.; Daniel, R.; Mitterer, C.; Dehm, G.: The peculiarity of the metal-ceramic interface. Scientific Reports 5, 11460 (2015)

Wimmer, A. C.; Heinz, W.; Leitner, A.; Detzel, T.; Robl, W.; Kirchlechner, C.; Dehm, G.: Micro-tension study of miniaturized Cu lines at variable temperatures. Acta Materialia 92, S. 243 - 254 (2015)

Jeon, J. B.; Dehm, G.: Formation of dislocation networks in a coherent Cu Σ3 (1 1 1) twin boundary. Scripta Materialia 102, S. 71 - 74 (2015)

Völker, B.; Heinz, W.; Matoy, K.; Roth, R.; Batke, J. M.; Schöberl, T.; Cordill, M. J.; Dehm, G.: Mechanical and chemical investigation of the interface between tungsten-based metallizations and annealed borophosphosilicate glass. Thin Solid Films 583, S. 170 - 176 (2015)

Völker, B.; Heinz, W.; Roth, R.; Batke, J. M.; Cordill, M. J.; Dehm, G.: Downscaling metal-dielectric interface fracture experiments to sub-micron dimensions: A feasibility study using TEM. Surface and Coatings Technology 270, S. 1 - 7 (2015)

Marx, V. M.; Toth, F.; Wiesinger, A.; Berger, J.; Kirchlechner, C.; Cordill, M. J.; Fischer, F. D.; Rammerstorfer, F. G.; Dehm, G.: The influence of a brittle Cr interlayer on the deformation behavior of thin Cu films on flexible substrates: Experiment and model. Acta Materialia 89, S. 278 - 289 (2015)

Imrich, P. J.; Kirchlechner, C.; Kiener, D.; Dehm, G.: Internal and external stresses: in situ TEM compression of Cu bicrystals containing a twin boundary. Scripta Materialia 100, S. 94 - 97 (2015)

Kapp, M. W.; Kapp, M. W.; Kirchlechner, C.; Pippan, R.; Dehm, G.: Importance of dislocations pile-ups on the mechanical properties and the Bauschinger effect in micro cantilevers. Journal of Materials Research 30 (6), S. 791 - 797 (2015)

Jaya, B. N.; Kirchlechner, C.; Dehm, G.: Can micro-scale fracture tests provide reliable fracture toughness values? A case study in silicon. Journal of Materials Research 30 (5), S. 686 - 698 (2015)

Harzer, T. P.; Djaziri, S.; Raghavan, R.; Dehm, G.: Nanostructure and mechanical behavior of metastable Cu–Cr thin films grown by molecular beam epitaxy. Acta Materialia 83, S. 318 - 332 (2015)

Heinz, W.; Robl, W.; Dehm, G.: Influence of initial microstructure on thermomechanical fatigue behavior of Cu films on substrates. Microelectronic Engineering 137, S. 5 - 10 (2015)

Völker, B.; Heinz, W.; Matoy, K.; Roth, R.; Batke, J. M.; Schöberl, T.; Scheu, C.; Dehm, G.: Interface fracture and chemistry of a tungsten-based metallization on borophosphosilicate glass. Philosophical Magazine 95 (16-18), S. 1967 - 1981 (2015)

Völker, B.; Venkatesan, S.; Heinz, W.; Matoy, K.; Roth, R.; Batke, J. M.; Cordill, M. J.; Dehm, G.: Following crack path selection in multi-film structures with weak and strong interfaces by in-situ 4-point-bending. Journal of Materials Research 30 (8), S. 1090 - 1097 (2015)

Wimmer, A. C.; Heinz, W.; Detzel, T.; Robl, W.; Nellessen, M.; Kirchlechner, C.; Dehm, G.: Cyclic bending experiments on freestanding Cu micron lines observed by EBSD. Acta Materialia 83, S. 460 - 469 (2015)

Zhang, Z.; Dehm, G.: Study on the Atomic and Electronic Structure in CrN (VN, TiN) Films using C_s-Corrected TEM. Microscopy and Microanalysis 21 (3), S. 2079 - 2080 (2015)